LED Support Assembly with Segmented Ceramic Substrates
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Solution Overview
Problem
Conventional LED modules face a conflict between thermal conductivity and mechanical strength, with thinner ceramic substrates providing efficient heat dissipation but being prone to breakage due to poor mechanical strength, while thicker substrates enhance strength but hinder heat transfer.
Innovation Solution
An LED support assembly is designed with a thinner first ceramic substrate for heat dissipation and a thicker second ceramic substrate for mechanical reinforcement, along with a copper heat sink, where the first substrate has higher thermal conductivity and lower coefficient of thermal expansion, and the second substrate has higher mechanical strength, allowing for effective heat transfer and structural integrity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a thinner ceramic substrate is used, then heat dissipation performance is improved, but mechanical strength deteriorates
Solution Approach 1:
The patent divides the support assembly into two separate ceramic substrates: a first ceramic substrate for heat dissipation and a second ceramic substrate for mechanical support. This segmentation allows each substrate to be optimized independently - the first substrate can be thin for efficient heat transfer, while the second substrate provides the necessary mechanical strength, resolving the contradiction between heat dissipation and mechanical strength
Solution Approach 2:
The patent uses a composite structure combining two different ceramic substrates with distinct functional properties. The first ceramic substrate is selected for high thermal conductivity, while the second ceramic substrate is selected for high mechanical strength. This composite approach allows the system to simultaneously achieve both excellent heat dissipation and sufficient mechanical strength
2Strength
If a thicker ceramic substrate is used, then mechanical strength is improved, but heat transfer efficiency deteriorates
Solution Approach 1:
The support structure is segmented into two functional layers: a thin first ceramic substrate in direct contact with the LED chip for efficient heat transfer, and a thicker second ceramic substrate for mechanical support. This segmentation eliminates the need to compromise heat transfer efficiency for mechanical strength, as each layer performs its designated function optimally
Solution Approach 2:
Different regions of the support assembly are assigned different thicknesses and material properties according to their specific functional requirements. The first ceramic substrate has thin thickness and high thermal conductivity for heat dissipation, while the second ceramic substrate has greater thickness and high mechanical strength for structural support,实现ing local optimization of properties
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration ensures both excellent heat dissipation and mechanical strength, improving the quality of LED chip encapsulation and reducing material costs by using different ceramic substrates, while also facilitating easier resin filling in the mounting cavity.
Implementation Method 1
a first ceramic substrate adapted to support a LED chip and disposed on the upper surface of the metal heat sink
Implementation Method 2
a metal heat sink defining an upper surface and a lower surface
Implementation Method 3
the means of FR-4 printing plate, metal core PCB (MCPCB), and ceramic PCB are used to radiate heat
Data Source
AI summary
An LED support assembly and an LED module are provided. The LED support assembly includes: a metal heat sink, a first ceramic substrate and a second ceramic substrate, the metal heat sink defines an upper surface; the first ceramic substrate is adapted to support a LED chip and disposed on the upper surface of the metal heat sink; the second ceramic substrate is adapted to support electrodes of the LED chip and surrounds the first ceramic substrate.