Light-emitting device with support frame for electrode bond strength
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Solution Overview
Problem
The dicing before grinding technique for producing light-emitting devices results in low bond strength between electrode portions of the metal substrate, leading to potential breakage during handling, especially for large devices with multiple LEDs connected in series.
Innovation Solution
Incorporating insulative portions with electrode separation grooves and a support frame that surrounds the metal substrate, with the support frame's inner wall formed within a recessed groove and outer wall covering the perimeter, to reinforce the bond between electrode portions and unify the substrate, enhancing the bond strength and rigidity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If dicing before grinding technique is used to produce light-emitting devices, then mass production efficiency is improved, but bond strength between electrode portions deteriorates
Solution Approach 1:
The invention divides the metal substrate into multiple electrode portions separated by insulative portions. This segmentation allows each electrode portion to be independently bonded to LEDs while maintaining overall structural integrity through the support frame, resolving the contradiction between mass production efficiency and bond strength.
Solution Approach 2:
The invention introduces insulative portions as intermediary elements between electrode portions. These insulative portions prevent electrical short circuits while providing mechanical support that enhances bond strength, enabling both mass production and reliable bonding simultaneously.
2Adaptability or versatility
If multiple LEDs are connected in series on a large metal substrate, then device functionality is improved, but substrate rigidity and durability deteriorate
Solution Approach 1:
The invention creates a composite structure combining metal substrate, insulative portions, and support frame. This composite design maintains substrate rigidity and durability while accommodating multiple LEDs connected in series, thus preserving both functionality and structural stability.
Solution Approach 2:
The invention adds a vertical dimension by introducing a support frame that extends from the metal substrate. This three-dimensional structure provides additional mechanical support and rigidity to the large substrate containing multiple series-connected LEDs, preventing breakage during handling.
3Reliability
If insulative portions are added to separate electrode portions, then electrical insulation is improved, but production complexity increases
Solution Approach 1:
The invention merges the functions of electrical insulation and mechanical support into a single integrated support frame structure. This reduces production complexity by eliminating the need for separate insulative components while maintaining reliable electrical insulation between electrode portions.
Solution Approach 2:
The support frame serves multiple functions simultaneously: providing mechanical support, ensuring electrical insulation between electrode portions, and maintaining substrate rigidity. This multi-functionality reduces overall production complexity while achieving reliable electrical insulation.
Data Source
Figure 1~2
Figure 3
Figure 4A~4D
AI summary
Provided is a light-emitting device that is mass-produced using a dicing before grinding technique. The light-emitting device includes electrode portions in a metal substrate, and the bond between the electrode portions, after being separated from one another by grinding, is strong. [Means of Realizing the Object] The light-emitting device includes a metal substrate 2, insulative portions 3, a plurality of LEDs 1a, 1b, a support frame 4, and a light-transmissive encapsulation resin 5. The metal substrate includes electrode portions 2a, 2b, 2c. The insulative portions are disposed in the metal substrate and each separate corresponding ones of the electrode portions from each other so that one of the electrode portions serves as an anode and an other of the electrode portions serves as a cathode. The insulative portions each include an electrode separation groove 3a in the metal substrate and an insulative resin 3b within the electrode separation groove. The LEDs are positioned at a surface of the metal substrate. The LEDs each lie over a corresponding one of the insulative portions and are each electrically coupled to corresponding ones of the electrode portions. The support frame is disposed so as to surround an outer perimeter of the metal substrate, and includes an inner wall portion 4b and an outer wall portion 4c. The inner wall portion is formed within a recessed groove 7 along the outer perimeter of the metal substrate. The outer wall portion covers an outer perimeter surface 8 of the metal substrate. The light-transmissive encapsulation resin is formed within the support frame to encapsulate at least partially the LEDs.