Light-emitting element support structure for reflow positioning
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Solution Overview
Problem
Light-emitting elements with exposed PN junctions tend to be unfavorably inclined during the reflow process due to solder hardening, leading to unstable positioning on circuit substrates and boards.
Innovation Solution
Incorporating a support structure on the rear surface of the light-emitting element, which can take the shape of I or T in rear plan view, to hold the element in place and prevent inclination, ensuring stable electrical connections and positioning even during reflow processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the light-emitting element is mounted on the circuit substrate using solder connections at the element electrodes, then electrical connection is achieved, but the element tends to be pulled backward during reflow process causing unfavorable inclination
Solution Approach 1:
The patent introduces a support structure (such as a solder resist pattern or protrusion) on the circuit substrate that prevents backward movement of the light-emitting element before and during the reflow process. This preliminary structural arrangement counteracts the pulling force that would otherwise cause unfavorable inclination, ensuring the element maintains its correct position throughout soldering and operation.
2Ease of operation
If the element electrodes are positioned at the rear surface of the body, then electrical connection to the board is enabled, but the element becomes prone to backward pulling and inclination during reflow
Solution Approach 1:
The patent introduces an intermediary support structure (solder resist pattern or substrate protrusion) between the light-emitting element and the circuit substrate. This intermediary component provides mechanical support that prevents backward movement during reflow, while still allowing electrical connection through the element electrodes to the board, thus resolving the conflict between connection ease and positioning precision.
3Device complexity
If no support structure is provided on the rear surface, then the structure remains simple, but the element cannot be stably disposed on the board surface
Solution Approach 1:
The patent applies local quality by providing a support structure (solder resist pattern or protrusion) only in the specific area where it is needed - on the circuit substrate at the rear surface region. This localized support prevents backward movement during reflow without requiring a complete structural redesign, thus maintaining overall simplicity while improving mounting stability.
Data Source
AI summary
A light-emitting element according to an embodiment of the present invention includes a body including an upper surface, a lower surface opposite to the upper surface, and a peripheral side surface extending between peripheral edges of the upper surface and peripheral edges of the lower surface, the peripheral side surface including a front surface and a rear surface opposite to the front surface; a pair of element electrodes as a first element electrode and a second element electrode positioned at the rear surface of the body; and a support disposed at the rear surface of the body between the first element electrode and the second element electrode that are positioned at a lower area of the rear surface of the body.