LED Package T-Shaped Electrodes Oxidation Resistance
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Solution Overview
Problem
Traditional LED packages face challenges with oxidation resistance due to humid air permeation and inadequate heat dissipation, leading to deterioration and degradation.
Innovation Solution
The LED package incorporates a substrate with T-shaped electrodes and grooves filled with Au oxidation-resistant metal coating layers, along with a reflective cup and encapsulation layer, to enhance oxidation resistance and heat dissipation by increasing the contacting area and extending the path of humid air, while the Au coating layers prevent oxidation and improve electrical conductivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If an encapsulation layer is formed on the substrate to encapsulate the LED die, then the LED die is isolated from humid ambient air, but humid air easily permeates into the inside of the LED package from the substrate-encapsulation layer interface due to weak bonding force, causing oxidation of the electrode
Solution Approach 1:
The electrode structure is changed from a flat planar configuration to a three-dimensional T-shaped configuration with vertical portions extending downward into the substrate. This dimensional change increases the electrode's contacting area with the substrate and extends the path that humid air must travel to reach the electrode, thereby improving oxidation resistance while maintaining encapsulation integrity
Solution Approach 2:
The electrode is divided into multiple segments: a top horizontal portion for electrical connection and vertical portions extending downward into the substrate. This segmentation allows the electrode to simultaneously maintain electrical connectivity and increase physical barrier against humid air permeation through the substrate-encapsulation layer interface
2Reliability
If the electrode area corresponding to bonding pads is increased for better electrical connection, then electrical conductivity improves, but the heat generated by the LED die is difficult to be dissipated, accelerating deterioration and degradation
Solution Approach 1:
The electrode transitions from a two-dimensional planar structure to a three-dimensional T-shaped structure with vertical components extending into the substrate. This dimensional transformation enables the electrode to simultaneously provide adequate electrical connection area at the top and extended heat dissipation pathways through the vertical portions that contact the substrate, thereby resolving the contradiction between electrical conductivity and heat dissipation
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution significantly improves oxidation resistance and heat dissipation, prolonging the LED package's lifespan by preventing air oxidation and effectively dissipating heat generated by the LED die.
Implementation Method 1
grooves (2011, 2111) are filled with Au oxidation-resistant metal coating layers (40, 41)... the Au coating layers prevent oxidation
Implementation Method 2
The substrate is a highly heat conductive and electricity insulated substrate... the heat generated by the LED die is effectively dissipated
Data Source
AI summary
A light emitting diode (LED) package includes a substrate, a first electrode and a second electrode embedded in the substrate and spaced from each other, an LED die mounted on a top surface of the substrate and electrically connected to the first and the second electrodes. Both the first and the second electrodes include a top face and a bottom face, with the top face and the bottom face of each of the first and the second electrodes being exposed at the top surface and a bottom surface of the substrate, respectively. The top face of the first electrode defines a first groove corresponding to a positive bonding pad (p-pad) of the LED die. The p-pad is partially inserted into the first groove. An oxidation-resistant metal coating layer is filled between an insertion portion of the p-pad and an inner surface of the first groove.