LED Transfer Assembly Using Protrusions and Adhesive Units
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The challenge in manufacturing light-emitting devices lies in efficiently arranging numerous light-emitting diodes on circuit boards within display and backlight modules, requiring an effective method to transfer and connect large numbers of LED chips, packages, or Chip Scale Packages (CSPs) to ensure proper alignment and electrical connectivity.
Innovation Solution
A method involving substrates with intermediate layers and adhesive units, where protrusions formed by laser are used to push light-emitting elements from one substrate to another, allowing for precise placement and connection of LED elements onto connecting pads, utilizing anisotropic conductive pastes or films to ensure both physical and electrical contact.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If traditional methods are used to arrange light-emitting diodes on circuit boards, then manufacturing process is simple, but manufacturing efficiency is low
Solution Approach 1:
The patent divides the manufacturing process into distinct stages: forming light-emitting elements on a first substrate, transferring them to a second substrate using protrusions, and connecting them to circuit boards. This segmentation allows each stage to be optimized independently, significantly improving manufacturing efficiency while managing complexity through structured process division.
Solution Approach 2:
The patent introduces a second substrate with protrusions as an intermediary carrier between the first substrate and the final circuit board. This intermediary enables efficient batch transfer of multiple light-emitting elements simultaneously, resolving the contradiction between manufacturing efficiency and process complexity by providing a dedicated transfer mechanism.
2Reliability
If light-emitting elements are transferred using protrusions and adhesive units, then connection reliability is improved, but manufacturing process complexity increases
Solution Approach 1:
The patent applies adhesive units to the protrusions in advance before the transfer process. This preliminary action ensures that when the protrusions contact the light-emitting elements, the adhesive is already in position to create reliable electrical and mechanical connections, improving connection reliability while keeping the actual transfer operation simple.
Solution Approach 2:
The patent combines multiple functions into the protrusions: they serve as mechanical pushers for transfer, electrical connectors through integrated adhesive units, and positioning elements. This merging reduces the number of separate components needed, improving reliability through integrated design while managing overall process complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables efficient transfer and connection of light-emitting elements, maintaining precise spacing and ensuring reliable electrical connections, thereby facilitating the assembly of light-emitting devices such as displays and backlight modules with improved efficiency and accuracy.
Implementation Method 1
connecting the second light-emitting element to the first adhesive unit
Data Source
AI summary
This disclosure discloses a method of manufacturing a light-emitting device includes steps of providing a first substrate with a plurality of first light-emitting elements and adhesive units arranged thereon, providing a second substrate with a first group of second light-emitting elements and a second group of second light-emitting elements arranged thereon, and connecting the a second group of second light-emitting elements and the adhesive units. The first light-emitting elements and the first group of second light-emitting elements are partially or wholly overlapped with each other during connecting the second group of second light-emitting elements and the adhesive units.