LED Transfer Base Plate With Clamping Grooves for Mass Alignment
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Solution Overview
Problem
Current LED transfer technologies, such as laser transfer, face low transfer rates and risk of performance degradation due to high-energy irradiation, and conventional methods like die bonders and stamp transfer are limited by precision and cost, particularly in mass transfer of mini-LEDs and micro-LEDs for high-resolution displays like 8K displays.
Innovation Solution
A method involving a target base plate with a barrier layer and clamping grooves is used, where LEDs are aligned within these grooves on a transfer base plate, allowing for mechanical separation without the need for high-energy processes, utilizing the barrier layer's strength to overcome bonding forces and facilitate efficient transfer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If laser transfer technology is used, then transfer precision can be improved, but transfer rate decreases and LED performance degradation occurs due to high-energy irradiation
Solution Approach 1:
The patent replaces the optical laser transfer system with a mechanical transfer system. A transfer substrate with clamping grooves mechanically engages the LED chips, and a transfer tool applies mechanical force to lift and move the LED chips from the growth substrate to the target substrate. This mechanical approach eliminates the need for high-energy laser irradiation while achieving precise positioning through the clamping groove structure.
Solution Approach 2:
The patent introduces a transfer substrate as an intermediary carrier between the growth substrate and the target substrate. The transfer substrate includes clamping grooves that mechanically engage the LED chips, serving as a mediator to facilitate precise and damage-free transfer. This intermediary structure enables controlled mechanical lifting and positioning without direct laser-LED interaction.
2Manufacturing precision
If conventional die bonders and needle bonders are used, then transfer precision can be maintained, but transfer rate becomes insufficient for mass transfer requirements
Solution Approach 1:
The patent merges multiple transfer operations into a single mechanical lifting action. The transfer substrate with multiple clamping grooves simultaneously engages multiple LED chips, and a single mechanical lifting motion transfers all engaged chips at once. This combines what would traditionally require multiple individual bonding operations into one unified transfer step, dramatically increasing throughput.
Solution Approach 2:
The patent performs preliminary alignment and engagement of LED chips with clamping grooves before the actual transfer. The transfer substrate is positioned and adjusted to ensure proper engagement of multiple chips with their corresponding grooves, so that when mechanical lifting occurs, all chips are transferred simultaneously with high precision. This preliminary positioning enables batch transfer without sacrificing accuracy.
3Productivity
If stamp transfer method is used, then transfer rate can be improved, but material costs increase due to PDMS and wafer arrangement requirements
Solution Approach 1:
The patent employs a reusable transfer substrate with a durable structure made from conventional semiconductor materials rather than expensive PDMS. The transfer substrate can be used repeatedly for multiple transfer operations, eliminating the need for costly disposable stamps and reducing material costs. The rigid structure provides mechanical strength for reliable chip engagement and transfer.
Solution Approach 2:
The transfer substrate serves multiple functions: it provides mechanical engagement through clamping grooves, enables precise positioning, facilitates batch transfer of multiple chips, and can be reused for multiple transfer operations. This multi-functional design replaces the need for specialized expensive materials like PDMS while achieving superior versatility and cost-effectiveness.
Data Source
AI summary
A method for transferring light-emitting diodes (LEDs) and a light-emitting base plate are disclosed. The method for transferring LEDs includes: providing a target base plate and a transfer base plate, wherein the target base plate includes a target substrate and a barrier layer, wherein a plurality of clamping grooves are formed by the barrier layer and the target substrate; and a plurality of LEDs are connected to a side of the transfer base plate; aligning the target base plate with the transfer base plate; and moving the transfer base plate in a preset direction, to cause the LEDs to be separated from the transfer base plate.