LED Display Module Transfer Layout for Seamless Color Uniformity

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Solution Overview

Problem

Existing display modules using LEDs face performance variations due to manufacturing tolerances, leading to non-uniformity in color and brightness across the wafer, and the formation of seams and periodic patterns in large format displays.

Innovation Solution

A method involving multiple relay substrates is employed to stretch array LEDs in both row and column directions, maintaining minimal gaps and transferring them to a target substrate while preserving color uniformity, thereby preventing seams and patterns.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If multiple LEDs are distributed across a wafer through epitaxial growth, then the number of LED chips per substrate is maximized, but performance variation (color, brightness) occurs between areas due to manufacturing tolerance

Engineering Contradiction:
Improvenumber of LED chips per substrateVSAvoidperformance uniformity of LEDs
Core Design Contradiction:
ProductivityVSManufacturing precision

Solution Approach 1:

The patent divides the wafer into multiple regions and uses separate epitaxial growth processes for different regions, allowing independent optimization of growth conditions for each region to compensate for position-dependent variations

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent applies different epitaxial growth conditions (temperature, pressure, gas flow rates) to different regions of the wafer based on their specific requirements, creating locally optimized LED performance across the substrate

Inventive Principle:
Principle #3Local quality

2Device complexity

If LEDs are transferred directly from substrate to target substrate, then the process is simple, but periodic patterns and seams appear in large format displays

Engineering Contradiction:
Improvetransfer process complexityVSAvoidvisual uniformity of display
Core Design Contradiction:
Device complexityVSManufacturing precision

Solution Approach 1:

The patent introduces relay substrates as intermediary carriers between the original substrate and the final target substrate, enabling multiple transfer steps that break up periodic patterns and prevent seam formation in large format displays

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The patent uses multiple relay substrates arranged in a multi-dimensional transfer sequence, transferring LEDs in stages across different substrates to disrupt repeating patterns that would otherwise appear in the final display

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Data Source

PatentUS12471427B2Display module and method for manufacturing display module
Publication Date: 2025.11.11 SAMSUNG ELECTRONICS CO LTD
  • US12471427B2 patent drawing
  • US12471427B2 patent drawing
  • US12471427B2 patent drawing

AI summary

A method for manufacturing a display module includes the steps of: transferring LEDs of a substrate to a first relay substrate; transferring the LEDs of the first relay substrate to a second relay substrate in a primary stretch array such that a gap between adjacent LEDs on the second relay substrate is greater than a gap between adjacent LEDs on the first relay substrate in one direction from among a row direction and a column direction; and transferring the LEDs of the second relay substrate to a target substrate in a secondary stretch array such that a gap between adjacent LEDs on the target substrate is greater than a gap between adjacent LEDs on the second relay substrate in a remaining direction from among the row direction and the column direction.