LED Transfer Detachment Using Linear Separation to Cut Defects
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current methods for transferring light emitting diodes (LEDs) from a wafer to a donor and subsequently to a display panel face issues such as defects, alignment precision, tensile stress, surface separation, and distortion, which affect the yield and quality of the display device.
Innovation Solution
A transfer device and method that involves bonding a wafer with LEDs to a donor, detaching them by moving the wafer and donor in a linear separation method, with the wafer moving in the X-axis direction to relieve tensile stress and minimize distortion, and using a stage, head, and fixing member to support and separate the components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a plurality of LEDs is transferred from a wafer to a donor using conventional methods, then the transfer process can be completed, but defects occur during the transferring process reducing yield
Solution Approach 1:
The wafer and donor are bonded together before the transfer process begins. This preliminary bonding action ensures that the LEDs remain properly positioned and prevents defects during subsequent manipulation and separation steps, thereby improving transfer yield
Solution Approach 2:
The transfer process is divided into distinct sequential steps: bonding the wafer to the donor, transferring the LEDs, and then detaching them in a controlled manner. This segmentation allows each step to be optimized independently, reducing defects and improving overall reliability
2Manufacturing precision
If LEDs are transferred using conventional methods, then the transfer can be completed, but alignment precision of the LEDs deteriorates
Solution Approach 1:
Alignment marks are established and the wafer is bonded to the donor before the actual transfer occurs. This preliminary alignment ensures that LEDs are precisely positioned on the donor substrate, maintaining high manufacturing precision throughout the process
3Ease of operation
If the wafer and donor are detached by conventional methods, then separation is achieved, but tensile stress is applied to the donor causing distortion
Solution Approach 1:
Instead of pulling the donor away from the wafer (which causes tensile stress and distortion), the wafer is moved in the X-axis direction while the donor remains relatively stationary. This inverted approach to detachment eliminates tensile stress on the donor, preventing shape distortion while still achieving successful separation
4Productivity
If conventional detachment methods are used, then the wafer and donor can be separated, but surface separation occurs in the latter part of the detaching process
Solution Approach 1:
The wafer is firmly bonded to the donor before detachment begins. This preliminary bonding ensures that during the detaching process, the wafer moves as a unified structure with the LEDs, preventing surface separation issues that would compromise manufacturing precision while maintaining efficient productivity
5Productivity
If LEDs are transferred using conventional methods, then the transfer process completes, but distortion of the LEDs occurs during detachment
Solution Approach 1:
The wafer is bonded to the donor before the transfer and detachment processes. This preliminary bonding provides structural support to the LEDs during manipulation, preventing distortion while allowing the transfer to complete efficiently. The bonded structure ensures LEDs maintain their shape throughout the process
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces defects, improves alignment precision, minimizes surface separation, and enhances the transfer yield of LEDs, resulting in a more stable and efficient manufacturing process for display devices.
Implementation Method 1
bonding a wafer in which a plurality of light emitting diodes is formed and a donor
Data Source
AI summary
Provided is a transfer method of a light emitting diode. The transfer method of the light emitting diode includes bonding a wafer in which a plurality of light emitting diodes is formed and a donor; transferring the plurality of light emitting diodes to the donor and detaching the wafer and the donor, the detaching of the wafer and the donor includes loading the bonded wafer and donor on a stage and a support member, fixing one of outermost portions of the donor by a fixing member, fixing one surface of the wafer to a head, moving the stage and the fixing member to a Z-axis direction, and moving the wafer and the head to an X-axis direction. Accordingly, the wafer and the donor are detached by the linear separation method to reduce the defective transfer of the plurality of light emitting diodes.