LED Manufacturing via Intermediate Plate Transfer Molding
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Solution Overview
Problem
Conventional manufacturing methods for light emitting diodes (LEDs) result in reduced light emission intensity due to broader directional angles and increased light loss, and struggle with uniform dispersion of heavy phosphors and increased thickness.
Innovation Solution
A manufacturing method involving a substrate with light emitting chips and an intermediate plate with through-holes and grooves, using a transfer molding process to form first molding portions within the substrate's cut surfaces, followed by optional second molding portions as reflectors or lenses to enhance light emission intensity without increasing thickness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If transparent molding portions are formed by transfer molding process, then mass production is enabled and inorganic phosphors are uniformly dispersed, but light emission intensity within desired directional angles is reduced and light loss increases
Solution Approach 1:
The patent divides the molding portions into two distinct types: transparent molding portions for enabling mass production and uniform phosphor dispersion, and opaque reflector-type molding portions for improving light emission intensity and controlling directional angles. This segmentation allows each type to fulfill its specific function without compromise.
Solution Approach 2:
Different regions of the LED package are assigned different optical properties: transparent molding portions are used in regions where mass production and phosphor dispersion are critical, while opaque reflector-type molding portions are used in regions where light emission intensity and directional control are prioritized. This local differentiation optimizes overall performance.
2Illumination intensity
If reflectors are attached or formed using injection molding to improve light emission intensity, then directional angle control is enhanced, but productivity is lowered and phosphor dispersion becomes non-uniform
Solution Approach 1:
The patent segments the molding portions into transparent types for mass production and opaque reflector types for improved light emission. The transparent molding portions maintain high productivity through transfer molding, while the opaque portions are selectively applied only where enhanced light emission is needed, avoiding the productivity loss of applying reflectors to all units.
Solution Approach 2:
Instead of applying reflector-type molding portions to all LED packages (which would reduce productivity across the board), the patent applies them partially only to specific positions where improved light emission intensity is most beneficial, thereby minimizing the impact on overall productivity while still achieving the desired optical enhancement.
3Reliability
If liquid phase resin is potted inside reflectors, then transparent molding portions can be formed, but molding time increases and phosphors with large specific gravity settle
Solution Approach 1:
The patent employs a disposable intermediate plate that is discarded after use. This plate enables the formation of transparent molding portions through transfer molding without requiring lengthy potting processes, thereby preventing phosphor settlement while maintaining productivity. The intermediate plate serves its purpose in the molding process and is then discarded, eliminating the need for complex, time-consuming alternative methods.
4Ease of manufacture
If molding portions extend to substrate cut surfaces, then transfer molding can be performed, but second molding portions cannot be formed on cut surfaces
Solution Approach 1:
The patent performs preliminary action by forming the transparent molding portions first using transfer molding before substrate cutting. After the substrate is cut, the intermediate plate is removed, exposing the cut surfaces. This sequence enables subsequent formation of second molding portions (reflectors or lenses) on the exposed cut surfaces, combining the advantages of both approaches.
Solution Approach 2:
The patent segments the molding process into two sequential stages: first forming transparent molding portions via transfer molding, then forming opaque second molding portions (reflectors or lenses) on the exposed cut surfaces after substrate removal. This segmentation allows both transfer molding feasibility and second molding portion formation to be achieved without conflict.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Improves light emission intensity within desired directional angles while preventing thickness increase and ensuring uniform phosphor dispersion, enhancing the efficiency and productivity of LED manufacturing.
Implementation Method 1
a transfer molding process is performed with a transparent molding material by using the grooves as runners so as to form first molding portions filling the through-holes
Implementation Method 2
materials with large specific gravity such as inorganic phosphors can be uniformly dispersed in the molding portions 14 due to shorter molding time
Implementation Method 3
light emitted from the light emitting chips 12 is emitted outwards through entire surfaces of the molding portions 14
Data Source
AI summary
Disclosed is a manufacturing method of a light emitting diode. The manufacturing method comprises the steps of preparing a substrate and mounting light emitting chips on the substrate. An intermediate plate is positioned on the substrate. The intermediate plate has through-holes for receiving the light emitting chips and grooves for connecting the through-holes to one another on its upper surface. A transfer molding process is performed with a transparent molding material by using the grooves as runners to form first molding portions filling the through-holes. Thereafter, the intermediate plate is removed, and the substrate is separated into individual light emitting diodes. Accordingly, it is possible to provide a light emitting diode in which the first molding portion formed through a transfer molding process is positioned within a region encompassed by cut surfaces of the substrate. Since the first molding portion is positioned within the region encompassed by the cut surfaces of the substrate, second molding portions can be symmetrically formed on the side surfaces of the first molding portions in various manners.