LED Transfer Using Energy Beam Release and Pixel Alignment
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Solution Overview
Problem
Existing methods for LED transfer between substrates lack sufficient knowledge and efficiency in mass transfer, selective transfer, or repair transfer, leading to incomplete knowledge and low yield in manufacturing light emitting devices.
Innovation Solution
A method involving the use of an energy beam to separate LEDs from a substrate, utilizing a carrier with a pixel defining layer and adhesive layers to facilitate accurate transfer and bonding to a driving substrate, enhancing the yield and reliability of LED devices through processes like mass, selective, and repair transfers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional LED transfer methods are used, then the manufacturing process is simple, but the transfer accuracy and success rate are low
Solution Approach 1:
The transfer process is segmented into distinct stages: positioning the substrate, illuminating specific regions with energy beams to release individual LEDs or groups of LEDs, and transferring them to the driving substrate. This segmentation enables precise control over which LEDs are transferred and where they are placed, significantly improving transfer accuracy while maintaining manageable process complexity through systematic organization of steps.
Solution Approach 2:
The substrate is prepared in advance with LEDs arranged in specific patterns and positions. The pixel defining layer on the driving substrate is pre-configured with holes at precise locations. This preliminary arrangement ensures that when LEDs are released by energy beam illumination, they can be accurately transferred to their designated positions, improving transfer success rate without requiring complex real-time adjustment mechanisms.
2Productivity
If mass transfer method is used, then productivity is improved, but control over selective transfer is lost
Solution Approach 1:
The energy beam illumination is applied locally to specific regions of the substrate rather than uniformly across the entire surface. By controlling the illumination area, the system can release and transfer either large groups of LEDs (mass transfer) or individual selected LEDs (selective transfer) from the same substrate. This local control mechanism enables the system to adapt between mass transfer for high productivity and selective transfer for specific positioning needs, resolving the contradiction between productivity and adaptability.
Solution Approach 2:
The transfer system is designed to be dynamic, allowing the illumination pattern and transfer parameters to be adjusted in real-time. The energy beam can be programmed to illuminate different regions sequentially or simultaneously, enabling the system to switch between mass transfer mode (illuminating large areas) and selective transfer mode (illuminating specific small regions). This dynamic adaptability allows the system to optimize for productivity when needed while maintaining the capability for selective transfer when required.
3Manufacturing precision
If selective transfer is performed, then precision is improved, but manufacturing time increases
Solution Approach 1:
The system merges multiple transfer operations into a single integrated process. By using the energy beam to release LEDs directly at their destination positions on the driving substrate, the method combines the release and transfer steps that would otherwise require separate operations. This merging allows selective transfer of individual LEDs with high positioning accuracy while reducing the total time required compared to conventional methods that require separate release, handling, and placement steps.
4Reliability
If conventional transfer methods are used, then equipment complexity is low, but yield and reliability are insufficient
Solution Approach 1:
The system replaces complex mechanical handling mechanisms with a non-contact energy beam-based release mechanism. Instead of using mechanical grippers, tweezers, or complex positioning stages to handle and transfer individual LEDs, the invention uses energy beam illumination to release LEDs from the substrate at precisely controlled locations. This substitution eliminates the need for complex mechanical transfer equipment while achieving high transfer yield and reliability through precise optical control.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Improves the accuracy and success rate of LED transfer, thereby increasing the yield and reliability of light emitting devices by ensuring precise alignment and bonding of LEDs to the driving substrate.
Implementation Method 1
illuminating a region of the substrate overlapped with the at least one of the elements by an energy beam
Data Source
AI summary
A method for manufacturing an electronic device is provided. The method for manufacturing the electronic device includes: providing a substrate with elements disposed thereon and transferring at least one of the elements from the substrate to a driving substrate, which includes illuminating a region of the substrate overlapped with the at least one of the elements by an energy beam, wherein the driving substrate includes a circuit board and a pixel defining layer disposed on the circuit board, and the pixel defining layer includes a hole for accommodating the at least one of the elements. A bottom surface of the at least one of the elements is higher than a top surface of the pixel definition layer when the region of the substrate is illuminated by the energy beam.