Sacrificial Substrate Transfer for RGB LED Displays
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Solution Overview
Problem
Current LED manufacturing processes are limited by the use of rigid substrates like silicon or sapphire, which cannot withstand high temperatures, making it difficult to produce LED devices on glass substrates due to melting issues, and simultaneously growing different colored LEDs on a single substrate is challenging.
Innovation Solution
A method involving the formation of LED device layers on a sacrificial substrate, patterning, and transferring them to a receiving substrate using a stamping processor like PDMS, allowing for the separation and alignment of RGB LEDs on a glass substrate for full-color displays, overcoming the limitations of traditional substrates and enabling mass production.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If glass substrates are used for LED display, then substrate flexibility and display quality are improved, but the substrate melts in high-temperature manufacturing processes
Solution Approach 1:
The manufacturing process is segmented into two distinct stages: first, LED devices are fabricated on temperature-resistant sacrificial substrates (silicon or sapphire) through high-temperature semiconductor processes; second, the completed LED devices are transferred to the final glass display substrate. This segmentation allows each substrate to be used in its optimal temperature range, resolving the contradiction between glass flexibility and high-temperature stability.
Solution Approach 2:
LED devices are preliminarily manufactured on sacrificial substrates before being transferred to the glass substrate. By completing all high-temperature manufacturing steps in advance on temperature-resistant substrates, the glass substrate is exposed only to low-temperature assembly processes, preventing melting while enabling the use of flexible glass displays.
2Productivity
If multiple colored LEDs are grown on a single substrate, then manufacturing efficiency is improved, but it is difficult to control the growth of different colored LEDs
Solution Approach 1:
Different regions of the sacrificial substrate are assigned different LED color types (red, green, blue) based on local material composition and growth conditions. By optimizing the local quality of semiconductor layers in specific substrate regions, each area produces the desired LED color with high precision, while the overall process maintains high manufacturing efficiency through parallel processing.
Data Source
AI summary
A method of manufacturing LED display is provided. The method provides a sacrificial substrate on which RGB LED device layers are formed, respectively. The method etches and patterns the LED device layer to manufacture RGB LED devices, respectively. The method removes the sacrificial substrate in a lower side of the LED device. The method contacts a stamping processor to the RGB LED devices to separate the RGB LED devices from the sacrificial substrate. The method transfers the LED device, which is attached to the stamping processor, to a receiving substrate.