LED Transfer Substrate Laser Ablation Layer Design
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Solution Overview
Problem
Existing methods for transferring light emitting diodes (LEDs) from a wafer to a target substrate often result in reduced efficiency and increased costs due to the limitations of contact-based laser transfer methods and the visibility of mura patterns on the target substrate.
Innovation Solution
A transfer substrate with a laser ablation layer and adhesive layer is used, allowing for non-contact laser transfer of LEDs through plasma etching and laser beam removal of exposed portions, enabling a grid arrangement with adjustable chip pitches to maintain the characteristic distribution of LEDs on the target substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If contact-based laser transfer method is used, then transfer process can be completed, but transfer efficiency is reduced and manufacturing cost increases
Solution Approach 1:
The patent replaces contact-based mechanical transfer methods with non-contact laser transfer. The laser beam directly ablates the transfer substrate to release LEDs without physical contact, eliminating mechanical complexity and improving transfer efficiency while reducing manufacturing costs.
Solution Approach 2:
The patent utilizes laser-induced phase transition of the transfer substrate material. The laser beam heats and ablates the transfer substrate, causing it to vaporize or decompose, thereby releasing the LEDs without mechanical contact and enabling efficient non-contact transfer.
2Reliability
If conventional transfer method is used, then LEDs can be transferred, but mura patterns become visible on target substrate
Solution Approach 1:
The patent applies local quality control by precisely controlling the laser ablation process at each LED location. The laser selectively removes material only where needed, ensuring uniform LED release and placement without creating mura patterns on the target substrate.
Solution Approach 2:
The patent uses laser ablation to create precise copies of the LED array pattern from the transfer substrate to the target substrate. The laser replicates the exact spatial arrangement of LEDs without the defects and variations that cause mura patterns in conventional transfer methods.
3Ease of manufacture
If fixed chip pitch arrangement is used, then manufacturing is simplified, but adaptability to different display requirements is reduced
Solution Approach 1:
The patent implements dynamic adaptability by allowing the chip pitch to be adjusted during the laser transfer process. The laser system can modify the spacing and arrangement of LEDs in real-time based on display requirements, transforming a static process into a dynamic, adaptable manufacturing system.
Solution Approach 2:
The patent enables parameter changes in the transfer process, specifically adjusting the chip pitch and arrangement patterns. By modifying laser parameters such as power, speed, and positioning, the system can produce different LED configurations to meet various display specifications while maintaining manufacturing efficiency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method improves transfer efficiency and reduces manufacturing costs while minimizing mura visibility by maintaining the LED's characteristic distribution and allowing for a seamless transition from one substrate to another.
Implementation Method 1
a laser ablation layer provided on the substrate
Implementation Method 2
removing the first exposed portions by a plasma etching process
Data Source
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AI summary
A transfer substrate for a light emitting diode is disclosed. The transfer substrate includes: a substrate; a laser ablation layer provided on the substrate; and an adhesive layer provided on the laser ablation layer and having a plurality of light emitting diodes attached thereto, wherein the laser ablation layer and the adhesive layer are divided into a plurality of portions corresponding to the plurality of light emitting diodes.