LED Transfer Substrate Segmentation for Precise Display Placement
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Solution Overview
Problem
Current methods for transferring light emitting diodes (LEDs) to display panels are inefficient, particularly in maintaining precise spacing and distribution, leading to increased manufacturing costs and potential mura visibility issues.
Innovation Solution
A transfer substrate with a laser ablation layer and adhesive layer is used, allowing for precise separation and transfer of LEDs using plasma etching and laser ablation, enabling efficient spacing and distribution of LEDs on the target substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional transfer methods (pick and place, stamping, laser transfer) are used, then LEDs can be transferred to display panels, but the spacing and distribution precision is poor leading to manufacturing cost increase and mura visibility issues
Solution Approach 1:
The transfer substrate is divided into multiple transfer regions, each corresponding to a specific LED arrangement pattern. This segmentation allows different regions to be optimized for different spacing requirements, achieving high precision LED placement while maintaining manufacturing efficiency through parallel processing of multiple regions
Solution Approach 2:
The LED array is pre-formed on the transfer substrate with precise spacing and distribution before transfer to the display panel. This preliminary arrangement eliminates the need for complex real-time positioning during transfer, reducing manufacturing costs while maintaining high precision placement
2Productivity
If conventional transfer methods are used, then LEDs can be transferred to display panels, but the transfer speed is slow reducing production efficiency
Solution Approach 1:
Multiple transfer operations are merged into a single integrated process. The transfer substrate contains multiple transfer regions that can be transferred simultaneously or in sequence without requiring separate positioning and alignment steps for each LED, thereby increasing transfer speed while maintaining spacing accuracy through the pre-defined transfer patterns
3Reliability
If LEDs are transferred using conventional methods, then display panels can be manufactured, but mura visibility issues occur due to poor LED distribution
Solution Approach 1:
Different transfer regions on the substrate are designed with locally optimized LED distribution patterns tailored to specific display panel requirements. This allows precise control over LED spacing and density in different areas, ensuring uniform light distribution and eliminating mura effects by matching the LED pattern to the local display requirements
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method improves the speed and accuracy of LED transfer, reduces manufacturing costs, and maintains the characteristic distribution of LEDs on the target substrate, minimizing mura visibility.
Implementation Method 1
a laser ablation layer provided on the substrate
Implementation Method 2
Removing the first exposed portions of the first laser ablation layer and the first adhesive layer may include removing the first exposed portions by a plasma etching process
Data Source
AI summary
A transfer substrate for a light emitting diode is provided. The transfer substrate includes a substrate, a laser ablation layer provided to the substrate, and an adhesive layer provided on the laser ablation layer and attached with a plurality of light emitting diodes, and the laser ablation layer and the adhesive layer may be divided into a plurality of portions corresponding to the plurality of light emitting diodes.