LED Transfer Support With Vacuum Through Holes
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Solution Overview
Problem
The industry faces challenges in rapidly and efficiently transferring light emitting diodes (LEDs) with different colors to a circuit substrate for monolithic micro-displays, as conventional methods struggle with epitaxial growth on shared substrates and low color conversion efficiency.
Innovation Solution
A transfer support and module that uses a vacuum apparatus with a transfer support having platforms, supporting pillars, and through holes to attract and transfer LEDs to a target substrate, enabling efficient alignment and attachment via vacuum-assisted air pumping.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If conventional epitaxial technique is used to grow multiple light emitting layers on a single substrate, then a single LED chip can emit different colored lights, but lattice constant differences make growth difficult and reduce manufacturing precision
Solution Approach 1:
The invention divides the growth process into separate segments by providing individual substrates for each light emitting layer. Each substrate is optimized for its specific layer's lattice constant, allowing high-quality epitaxial growth for each color without compromise from lattice mismatch with other layers.
Solution Approach 2:
The invention introduces transfer substrates as intermediaries between the growth substrates and the final LED chip. These transfer substrates enable the separation of growth and integration processes, allowing each layer to be grown on its optimal substrate and then transferred to the final chip structure.
2Adaptability or versatility
If color conversion materials are used with LED chips, then different colored lights can be emitted, but conversion efficiency and coating uniformity are reduced
Solution Approach 1:
The invention extracts the color generation function from color conversion materials and implements it directly in the light emitting layers themselves. Each layer is designed to emit its specific color through direct bandgap emission, eliminating the need for intermediate color conversion processes and their associated efficiency losses.
3Manufacturing precision
If transfer-bonding technique is used to transfer LEDs to circuit substrate, then epitaxial quality and light-emitting efficiency are improved, but transfer speed and efficiency are reduced
Solution Approach 1:
The invention performs preliminary alignment and positioning actions during the transfer process. The transfer substrate is pre-configured with alignment features and the transfer apparatus includes positioning mechanisms that prepare the system in advance, enabling rapid transfer without compromising epitaxial quality through slow, careful manual handling.
Solution Approach 2:
The invention replaces slow, manual mechanical transfer methods with an automated transfer apparatus that uses controlled mechanical forces and fields. This automated system can rapidly transfer multiple LED chips simultaneously while maintaining the precision required for high-quality epitaxial bonding.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution allows for rapid and efficient transfer of LEDs, enhancing the brightness and display quality of monolithic micro-displays by improving the epitaxial quality and light-emitting efficiency of the LEDs.
Implementation Method 1
The transfer support is disposed on the vacuum apparatus to cover the exhausting vent... attracting the plurality of elements to the platforms via the plurality of through holes
Data Source
AI summary
A transfer support adapted to contact a plurality of elements is provided. The transfer support has a first surface, a second surface opposite to the first surface, a recess located on the second surface, a plurality of platforms protruded from the first surface, a plurality of supporting pillars distributed in the recess and a plurality of through holes. The platforms have carry surfaces adapted to contact the plurality of elements. The through holes extend from the carry surfaces of the platforms to the recess, and two of the adjacent supporting pillars are spaced apart from each other to form an air passage. In addition, a transfer module is also provided.