LED Transfer Bonding Under Vacuum to Prevent Base Sagging
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Solution Overview
Problem
The manufacturing process of light-emitting diode display panels faces challenges in bonding yield due to sagging temporary storage bases and uneven stages, leading to incomplete bonding of light-emitting diodes with pad sets under the influence of gravity.
Innovation Solution
A manufacturing method involving a driving back board with pad sets and a light-emitting element array base with an adhesive layer and sealant, aligned and pressed together in a near-vacuum environment, followed by a soldering process to bond the light-emitting elements with the pad sets, using an auxiliary element to maintain evenness and prevent warping.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If light-emitting diodes are transferred from temporary storage base to driving back board under gravity, then the transfer process is simple, but the temporary storage base sags causing decreased bonding yield
Solution Approach 1:
The patent applies vacuum pressure as a counteracting force to gravity. By creating a vacuum environment in the bonding chamber, the atmospheric pressure pushes the temporary storage base and driving back board together, preventing sagging and ensuring uniform contact between light-emitting diodes and pad sets during the bonding process.
Solution Approach 2:
The patent uses a vacuum environment as an inert atmosphere for the bonding process. This vacuum chamber eliminates gravitational sagging effects and provides a controlled environment that ensures precise alignment and bonding between components without the adverse effects of gravity and atmospheric interference.
2Device complexity
If conventional bonding process is used without vacuum environment, then the process is straightforward, but stage unevenness affects bonding yield
Solution Approach 1:
The patent employs a vacuum chamber to create an inert environment during bonding. This vacuum environment eliminates the effects of stage unevenness by applying uniform atmospheric pressure across the bonding interface, ensuring that light-emitting diodes bond reliably with pad sets regardless of minor stage variations.
Solution Approach 2:
The patent replaces reliance on mechanical stage precision with a vacuum-based bonding system. Instead of depending on perfectly flat and level stages, the vacuum environment provides a self-aligning mechanism where atmospheric pressure ensures uniform contact and bonding, substituting mechanical precision requirements with a more robust physical field approach.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method significantly improves the bonding yield by ensuring even alignment and pressure distribution, resulting in a higher success rate of light-emitting diodes being bonded with the pad sets, enhancing the overall efficiency of the manufacturing process.
Implementation Method 1
aligned and pressed together in a near-vacuum environment
Data Source
AI summary
An electronic device includes a temporary storage base, an adhesive layer, light-emitting elements, and a sealant. The adhesive layer is disposed on the temporary storage base. The light-emitting elements are disposed on the adhesive layer. The sealant is disposed on the temporary storage base and surrounds the adhesive layer. In addition, other electronic devices and a manufacturing method of the electronic device are also provided.