Light-emitting device translucent adhesive layer uniformity
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional light-emitting devices experience reduced light extraction efficiency and non-uniform optical intensity due to the depression of optical intensity in regions between light-emitting elements, particularly when multiple elements are arranged side by side.
Innovation Solution
A light-emitting device configuration that includes a mounting board with light-emitting elements, a wavelength conversion member, and a translucent adhesive layer with a thin film portion of constant thickness between the elements, which reduces light attenuation by acting as an optical waveguide and promoting multiple reflections between the wavelength conversion member and a covering body.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If multiple light-emitting elements are placed side by side to form one light-emitting device, then the light output is increased, but depression of optical intensity occurs in the region between the light-emitting elements
Solution Approach 1:
A translucent member (adhesive layer) is introduced as an intermediary between the light-emitting elements and the wavelength conversion member. This translucent member has a thin film portion in the region between light-emitting elements that guides light from the elements toward the wavelength conversion member, preventing light depression in the intermediate region and improving optical intensity uniformity while maintaining increased light output
Solution Approach 2:
The translucent member has different thickness characteristics in different regions: a thin film portion in the region between light-emitting elements and a thicker portion over the elements themselves. This local variation in thickness optimizes light guidance in the critical gap regions while maintaining proper optical coupling over the emitting elements
2Illumination intensity
If a wavelength conversion member is added to convert wavelength of light, then the light emission color is adjusted, but light extraction efficiency is reduced due to multiple reflections and feedback light absorption
Solution Approach 1:
The translucent member acts as an intermediary optical element between the light-emitting elements and the wavelength conversion member. By controlling the thickness and optical properties of this intermediate layer, light is guided more effectively toward the wavelength conversion member, reducing feedback reflections and improving overall light extraction efficiency while maintaining the desired wavelength conversion function
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances light extraction efficiency and achieves uniform optical intensity across the light extraction surface by minimizing feedback light absorption and scattering, thereby increasing the overall light output and reducing intensity differences between element regions.
Implementation Method 1
a translucent member that covers a lower surface of the wavelength conversion member and covers the semiconductor structure layer on the supporting substrate; The translucent member includes a thin film portion having a constant film thickness between the wavelength conversion member and the resin member in a region between the plurality of light-emitting elements
Implementation Method 2
a resin member filled between the plurality of light-emitting elements, the resin member being formed of a resin material containing particles having a light reflectivity
Data Source
AI summary
A light-emitting device according to the present invention comprises: a mounting board; a plurality of light-emitting elements that each include a supporting substrate and a semiconductor structure layer, the supporting substrate being disposed on the mounting board, and the semiconductor structure layer being formed on the supporting substrate and including a light-emitting layer, a wavelength conversion member that covers the plurality of light-emitting elements above the light-emitting elements and converts a wavelength of a light emitted from the light-emitting layer; a translucent member that covers a lower surface of the wavelength conversion member and covers the semiconductor structure layer on the supporting substrate; and a resin member filled between the plurality of light-emitting elements, the resin member being formed of a resin material containing particles having a light reflectivity. The translucent member includes a thin film portion having a constant film thickness between the wavelength conversion member and the resin member in a region between the plurality of light-emitting elements, and the constant film thickness is smaller than a distance between a top surface of the supporting substrate and a lower surface of the wavelength conversion member.