Light Transmissive Substrate for LED Electrode Identification
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Solution Overview
Problem
The high manufacturing costs of light emitting diode (LED) packages hinder mass production efficiency, particularly due to complex and costly processes for identifying and connecting electrodes during the assembly of LED packages.
Innovation Solution
A method involving the use of a light transmissive substrate with insulating properties, such as SiO2, which is bonded to the LED structure using adhesives like water glass or silicone, allowing for the formation of via electrodes and simplifying the identification and connection of electrodes through optical means, reducing the need for expensive instruments and processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If conventional opaque substrates are used for LED package assembly, then structural support is provided, but electrode identification and positioning becomes difficult requiring expensive instruments
Solution Approach 1:
The patent introduces a light-transmissive substrate as an intermediary between the LED chip and the assembly environment. This substrate allows optical instruments to penetrate and directly visualize electrodes on the LED chip surface, eliminating the need for complex non-optical detection instruments while improving electrode identification accuracy during assembly operations.
Solution Approach 2:
The patent replaces complex mechanical or electronic detection systems with simple optical observation. By making the substrate light-transmissive, standard optical instruments can directly view and identify electrode positions without requiring sophisticated measurement equipment, thereby reducing device complexity while improving measurement precision.
2Manufacturing precision
If complex electrode identification processes are used, then accurate electrode positioning is achieved, but manufacturing time and costs increase
Solution Approach 1:
The patent performs preliminary action by preparing the light-transmissive substrate before LED chip assembly. This substrate preparation enables direct optical visualization of electrodes during subsequent assembly steps, eliminating the need for time-consuming complex identification processes and allowing accurate electrode positioning to be achieved more quickly.
Solution Approach 2:
The light-transmissive substrate serves as a mediator that simplifies the electrode positioning process. It enables operators to directly observe electrode positions through the substrate using simple optical tools, thereby achieving accurate electrode positioning without requiring complex identification procedures that would extend manufacturing cycle time.
3Reliability
If expensive instruments and complex processes are used for electrode connection, then reliable connections are achieved, but manufacturing costs increase
Solution Approach 1:
The light-transmissive substrate acts as an intermediary that enables reliable electrode connections through simple optical observation. Operators can accurately identify and position electrodes during assembly using basic optical tools rather than expensive specialized instruments, thereby maintaining connection reliability while reducing manufacturing costs.
Solution Approach 2:
The patent replaces expensive complex identification and positioning systems with simple optical observation made possible by the light-transmissive substrate. This substitution maintains electrode connection reliability through accurate visual positioning while significantly reducing the cost of manufacturing equipment and processes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces manufacturing costs and time by enabling easier electrode positioning and connection, improving the efficiency of LED package production while maintaining the integrity of the LED structure.
Implementation Method 1
identifying positions of the first and second electrodes that are seen through the second surface of the light transmissive substrate
Implementation Method 2
bonding the light transmissive substrate to the light emitting structure by applying a light transmissive adhesive to a surface of the light emitting structure
Implementation Method 3
forming first and second via electrodes by filling the through holes with a conductive material
Data Source
AI summary
A method of manufacturing a light emitting diode (LED) package may include forming a light emitting structure having a first conductivity-type semiconductor layer, an active layer and a second conductivity-type semiconductor layer on a growth substrate, forming first and second electrodes connected to the first and second conductivity-type semiconductor layers, respectively, bonding a first surface of a light transmissive substrate opposite to a second surface thereof to the light emitting structure, identifying positions of the first and second electrodes that are seen through the second surface of the light transmissive substrate, forming one or more through holes in the light transmissive substrate to correspond to the first and second electrodes, and forming first and second via electrodes by filling the through holes with a conductive material.