LED Array Trench Isolation for Light Reflection and Heat Dissipation
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Solution Overview
Problem
In light emitting diode (LED) applications, achieving sufficient brightness requires proper light blocking between adjacent LEDs to prevent radiation absorption and maximize output efficiency, which existing technologies have not adequately addressed.
Innovation Solution
A light emitting diode array is designed with a substrate, dielectric layer, plug, and conductive connection layer, where each LED chip is isolated by a trench, and the dielectric layer covers the substrate and semiconductor layers, while the plug fills the trench and is surrounded by the dielectric layer to connect electrodes, enhancing light output efficiency and heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If multiple LED chips are disposed adjacent to each other on a substrate, then the brightness output is increased, but the emitted radiation from one LED chip may be absorbed by adjacent LED chips, reducing the radiation output efficiency
Solution Approach 1:
The patent divides the substrate into separate regions by forming trenches between adjacent LED chips. This segmentation physically separates the LED chips, preventing radiation from one chip from being absorbed by adjacent chips, thereby resolving the energy loss problem while maintaining high brightness output through multiple chips
Solution Approach 2:
The patent introduces a dielectric layer as an intermediary material that fills the trenches between LED chips. This dielectric layer acts as a mediator that blocks radiation transmission between adjacent chips while maintaining the structural integrity and electrical connectivity of the array
2Loss of energy
If trenches are formed between LED chips to block radiation, then the radiation output efficiency is improved, but the structural complexity and manufacturing difficulty increase
Solution Approach 1:
The dielectric layer serves multiple functions simultaneously: it blocks radiation between chips, provides structural support, enables electrical connectivity through conductive plugs, and facilitates heat dissipation. This multi-functionality reduces the need for additional separate components, thereby managing structural complexity
3Loss of energy
If a dielectric layer and plug structure are used to isolate and connect LED chips, then the radiation output efficiency and heat dissipation are enhanced, but the manufacturing process complexity increases
Solution Approach 1:
The trenches are formed between LED chips during the initial fabrication process before the chips are fully assembled and wired. This preliminary structuring simplifies subsequent manufacturing steps by pre-establishing the radiation-blocking framework and facilitating easier integration of conductive plugs and dielectric layers
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration improves radiation output efficiency by reflecting emitted light away from adjacent LEDs and enhances heat dissipation, thereby maximizing the performance of the LED array.
Implementation Method 1
improves radiation output efficiency by reflecting emitted light away from adjacent LEDs
Implementation Method 2
enhancing light output efficiency and heat dissipation
Data Source
AI summary
A light emitting diode (LED) array includes a substrate with an array having a plurality of LED chips thereon, a dielectric layer, a plug, and a conductive connection layer. Each of the LED chips is isolated from another LED chip adjacent thereto by a trench. The dielectric layer covers a surface of the substrate exposed by the trench and sidewalls and partial surfaces of the LED chips adjacent to the trench. The plug fills the trench. The conductive connection layer is disposed over the plug and the dielectric layer to connect the LED chips with the LED chips adjacent thereto. Radiation emitted from one of the LED chips can be reflected by the dielectric layer and the plug, and finally reflected and output from a side of the LED chip not adjacent to the trench, thereby not affecting the adjacent LED chip and being absorbed by it.