LED Unit with Anodized Aluminum Base and Thermal Paste
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Solution Overview
Problem
High output LEDs face issues with heat generation leading to reduced luminous efficiency, heat-induced deterioration of reflectors, and potential separation of LED chips from their base, due to inadequate heat release and reflection efficiency.
Innovation Solution
An LED unit with a base made of high heat conductivity material, such as an anodized aluminum plate, featuring a printed board with a conductive pattern and sealing resin-injection holes, where LED chips are mounted within the opening of the printed board and covered by a lens member with sealing resin injected between the lens and the chip, enhancing heat dissipation and reflection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the LED chip is mounted on the first electrode to simplify assembly, then ease of manufacture is improved, but heat release capability deteriorates
Solution Approach 1:
The patent introduces a white paste as an intermediary substance between the LED chip and the first electrode. This white paste serves dual functions: it provides electrical connection (mediating the electrical circuit) and acts as a thermal interface material to improve heat transfer from the LED chip to the electrode, thereby resolving the contradiction between ease of assembly and heat release capability
Solution Approach 2:
The patent employs composite material structures, specifically the combination of conductive adhesive and white paste layers, to achieve both electrical connectivity and thermal management. The multi-layer composite structure allows simultaneous optimization of electrical performance and heat dissipation while maintaining simple assembly procedures
2Illumination intensity
If high output LEDs are used to increase light emission, then illumination intensity is improved, but heat generation increases leading to reduced luminous efficiency
Solution Approach 1:
The patent converts the harmful heat generated by high-output LEDs into a beneficial thermal management opportunity. By implementing a dedicated heat release structure with the base, opening, and white paste thermal interface, the design transforms waste heat into a controllable thermal flow path, improving overall luminous efficiency while maintaining high light emission output
3Temperature
If the LED chip is directly mounted on the base to improve heat release, then heat conductivity is improved, but the LED chip may separate from the base due to thermal expansion
Solution Approach 1:
The patent uses a composite bonding structure consisting of conductive adhesive and white paste layers between the LED chip and first electrode. This composite material system accommodates thermal expansion differences through its layered composition, maintaining bonding stability while ensuring both electrical connectivity and thermal conduction pathways
Solution Approach 2:
The patent modifies the bonding interface parameters by introducing multiple layers with different thermal and mechanical properties. The white paste layer specifically changes the thermal conductivity parameter at the interface, while the conductive adhesive provides mechanical bonding, together resolving the contradiction between heat release and bonding stability
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables rapid heat release, high luminous efficiency, and stable long-term performance by effectively managing heat transfer and maintaining reflection efficiency while preventing surface oxidation and separation of the LED chip from the base.
Implementation Method 1
a base made of a material having high heat conductivity
Implementation Method 2
a lens section 4 which is disposed above the LED chip 3 and attached to the case 2
Implementation Method 3
at least two sealing resin-injection holes to inject a sealing resin in a space provided between the LED chip disposed on the base and the lens member
Data Source
AI summary
A light emitting diode unit including a base (100) made of anodized aluminum and a printed board (101) attached to the base (100) and the printed board (101) including a predetermined conductive pattern (102) and an opening (101a) having an area for die-bonding at least one LED chip (113) to the base (100) through a transparent paste, an upper electrode of the at least one LED chip being wire-bonded to a conductive pattern (102) provided on the printed board (101) through a gold line (110), and a lens member (105) including at least two sealing resin-injection holes (106c) and being attached to the printed board (101) to form a space surrounding the at least one LED chip on the base, and the space being filled with the sealing resin by way of the resin-injection holes (106c) to seal the at least one LED chip.