Lens Module Groove Design for Circuit Board Collision Prevention
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Solution Overview
Problem
Existing lens modules in electronic devices face issues with dimensional tolerance, leading to potential collisions between the bracket and the circuit board during active alignment, which can cause damage to the circuit board.
Innovation Solution
The lens module design includes a connecting board with a first groove, where the circuit board is partially disposed and protrudes from the connecting board's surface, increasing the space between the connecting board and the bracket. This configuration allows for a thicker adhesive layer, reducing the risk of collision between the bracket and the circuit board without increasing the overall height of the lens module.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the lens size and dimensional tolerance are large, then the lens can be manufactured more easily, but the risk of collision between the bracket and circuit board increases during active alignment
Solution Approach 1:
A cushioning structure is introduced as an intermediary element between the bracket and the circuit board. This cushioning structure absorbs the collision force during active alignment, preventing direct contact between the bracket and circuit board, thereby resolving the contradiction between ease of lens manufacturing and circuit board protection
Solution Approach 2:
The cushioning structure is pre-installed in the bracket before the active alignment process. This beforehand cushioning ensures that when dimensional tolerance variations occur during lens assembly, the cushioning structure is already in place to prevent collision damage to the circuit board
Data Source
AI summary
The present disclosure provides a lens module and an electronic device with lens module. The lens module includes a lens, a bracket, a connecting board, a circuit board and a first adhesive layer. The lens is connected on the bracket. The connecting board has a first surface facing the bracket. A first groove is formed on the first surface of the connecting board. The circuit board is disposed in the groove and protrudes from the first surface. A photosensitive film is disposed on the circuit board. The bracket is connected on the connecting board through the first adhesive layer.