Lens Module Integration via Redistribution Layer
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Solution Overview
Problem
Current lens modules face challenges in miniaturization and ultra-thin thickness requirements due to the separation of photosensitive chips and functional components, leading to increased size and reduced signal transmission rates, which affects image capturing and storage speed.
Innovation Solution
Integrating photosensitive chips and functional components into an encapsulation layer with a redistribution layer structure, eliminating the need for circuit boards and reducing the distance between components, thereby improving signal transmission and module performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If photosensitive chips and functional components are separated and mounted on different substrates, then ease of manufacture is improved, but device size increases and signal transmission speed decreases
Solution Approach 1:
The patent merges the photosensitive chip and functional components onto a single substrate, eliminating the need for separate substrates and inter-substrate connections. This integration directly reduces the overall module size while maintaining manufacturability through standardized mounting processes.
Solution Approach 2:
The patent employs a layered structure where the photosensitive chip is mounted on the substrate, and functional components are positioned around and above it. The lens assembly is then mounted on top, creating a nested configuration that minimizes the horizontal footprint and reduces module size.
2Ease of manufacture
If photosensitive chips and functional components are separated and mounted on different substrates, then ease of manufacture is improved, but signal transmission speed decreases
Solution Approach 1:
By integrating the photosensitive chip and functional components on the same substrate, the patent eliminates inter-substrate signal transmission paths. This reduces signal transmission distance and improves speed, while the substrate's circuit traces provide direct electrical connections between components.
3Measurement precision
If lens modules are designed with large imaging area photosensitive chips, then image capturing quality is improved, but device size increases
Solution Approach 1:
The patent utilizes the vertical dimension by mounting functional components above and around the photosensitive chip in a three-dimensional arrangement. This allows large imaging area chips to be used without proportionally increasing the horizontal footprint, thus maintaining image quality while controlling overall module size.
4Ease of manufacture
If circuit boards are used to connect photosensitive chips and functional components, then ease of manufacture is improved, but module thickness increases
Solution Approach 1:
The patent eliminates the separate circuit board by integrating all electrical connections onto the substrate itself. The substrate serves as both the mechanical support and the electrical interconnection medium, removing the additional thickness that would be required for a separate circuit board layer.
Data Source
AI summary
An image capturing assembly includes an encapsulation layer, embedded with functional components. The top surface and bottom surface of the encapsulation layer expose the functional components. A through hole is formed in the encapsulation layer; and the functional components have soldering pads facing away from a bottom of the encapsulation layer. A photosensitive unit including a photosensitive chip and an optical filter is mounted on the photosensitive chip. The photosensitive chip is embedded in the through hole; the optical filter is outside the through hole; the top surface and bottom surface of the encapsulation layer expose the photosensitive chip; and the photosensitive chip includes soldering pads facing away from the bottom of the encapsulation layer. A redistribution layer structure is on the top side of the encapsulation layer and electrically connects the soldering pads of the photosensitive chip with the soldering pads of the functional components.