Lens Module Support Clip Structure for High-Temperature Adhesion
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Solution Overview
Problem
The existing lens modules face issues with the detachment of glue or lenses from the substrate, particularly due to the flow of glue during curing and the reduced adhesive properties of organic-based glues at high temperatures.
Innovation Solution
A lens module design that includes a substrate with light emitting regions, light emitting devices, a lens unit, glue, and a support member mounted in the glue. The support member, which can be a metal sheet with a hump and clip, increases the contact area and adhesion between the glue and the substrate, and secures the lens unit through elastic deformation of the clip holder and clip.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If organic-based glue is used to attach the optical lens to the light emitting diode package, then the lens can be securely attached at normal temperatures, but the glue characteristics are reduced at high temperatures causing detachment
Solution Approach 1:
The patent changes the material parameter of the adhesive from organic-based glue to inorganic-based adhesive material, which fundamentally alters the temperature resistance characteristics while maintaining attachment functionality at normal temperatures
Solution Approach 2:
The patent uses a composite structure combining inorganic-based adhesive material with the light emitting diode package and optical lens, creating a multi-material assembly that overcomes the limitations of organic glue at high temperatures
2Ease of manufacture
If glue is used to attach the optical lens, then the lens can be positioned on the light emitting diode package, but the glue flows during curing causing arrangement location shift
Solution Approach 1:
The patent changes the physical state parameter of the adhesive from liquid glue that flows during curing to inorganic-based adhesive material with controlled viscosity, preventing location shift while maintaining ease of attachment
Solution Approach 2:
The inorganic-based adhesive material acts as an intermediary between the light emitting diode package and optical lens, providing both positioning functionality and flow control during the attachment process
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The proposed solution effectively prevents the glue and lens from detaching from the substrate, enhancing the adhesion and securing mechanism, even under conditions of high temperature or mechanical stress.
Implementation Method 1
attaching the optical lens to the light emitting diode package with an inorganic-based adhesive material
Implementation Method 2
an elastic member pressing the optical lens and the light emitting diode package onto each other
Data Source
AI summary
Disclosed herein is a lense module. A lens module according to an exemplary embodiment of the present disclosure includes a substrate having a plurality of light emitting regions, a light emitting devices provided in each of the plurality of light emitting regions to emit light, and a lens unit provided on the substrate to cover the light emitting devices, a glue contacting the substrate and the lens unit to secure the substrate and the lens unit, and a support member provided in the glue and mounted on the substrate. The support member includes a hump for increasing a contact area between the support member and the glue, and a clip connected to the lens unit.