Lens Wafer Release Element for Damage-Free Detachment
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Solution Overview
Problem
The separation of monolithic lens wafers from embossing molds represents a significant technical challenge, particularly in mass production, due to the difficulty in detaching them without damage and the need for manual handling.
Innovation Solution
Incorporating release elements between the embossing dies before curing, allowing for automatic detachment of the lens wafer after curing, using materials with low adhesion properties and optimized thickness for minimal damage and efficient release.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If manual handling is used for detaching lens wafers from embossing molds, then damage risk is reduced, but production efficiency decreases
Solution Approach 1:
A release element is introduced as an intermediary component between the lens wafer and the embossing mold. This release element facilitates automatic detachment by creating a controlled interface that reduces adhesion forces, enabling automated handling without increasing damage risk to the fragile lens wafer
2Extent of automation
If release elements are added to the embossing device, then automatic detachment is enabled, but device complexity increases
Solution Approach 1:
The embossing device is segmented into distinct functional components: the embossing mold, the release element, and the lens wafer. This segmentation allows the release element to be independently positioned and removed, simplifying the automation process while enabling automatic detachment without requiring complex integrated systems
3Quantity of substance
If release elements are positioned in unstructured peripheral regions, then microlens yield is maintained, but detachment effectiveness may be reduced
Solution Approach 1:
The release element utilizes the peripheral dimension of the embossing mold, positioning itself in the unstructured region outside the microlens array. This spatial arrangement in another dimension (the peripheral zone) allows detachment functionality to be added without encroaching on the active microlens formation area, thereby maintaining microlens yield while enabling effective detachment through the release element's strategic peripheral placement
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables automatic, damage-free detachment of carrier-free lens wafers, enhancing production efficiency and flexibility in optical design, suitable for mass production with reduced risk of lens wafer damage.
Implementation Method 1
using materials with low adhesion properties and optimized thickness for minimal damage and efficient release
Data Source
AI summary
A device for producing a lens wafer with a plurality of microlenses with an upper die and a lower die for embossing of the lens wafer from a fluid embossing mass which has been delivered between the dies, curing means for curing of the embossed lens wafer, characterized in that at least one release element for detachment of the cured lens wafer prior to curing can be located between the lower die and the upper die.