Single-Die Level Shifter for Ground Domain Voltage Differences
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Solution Overview
Problem
Existing level shifter circuits fail to effectively translate signals across different ground domains, leading to complexity and cost issues due to the need for multiple dies, and cannot accommodate DC or AC voltage differences between circuit grounds.
Innovation Solution
A single-die level shifter circuit that includes a driver circuit, receiver circuit, capacitors, and substrate bias circuit, capable of translating signals across ground domains while tolerating DC or AC voltage differences, using a single semiconductor substrate to reduce complexity and cost.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If existing level shifter circuits are used to translate signals across different ground domains, then signal translation between different voltage levels is achieved, but the circuits cannot accommodate DC or AC voltage differences between grounds and require multiple dies increasing complexity
Solution Approach 1:
The patent combines the driver circuit and receiver circuit onto a single semiconductor substrate, eliminating the need for multiple dies. The substrate bias circuit integrates ground domain adaptation functionality directly into the substrate structure, merging previously separate functions into one unified device that handles both signal translation and ground domain compatibility.
Solution Approach 2:
The substrate bias circuit provides multi-functionality by simultaneously handling DC voltage differences, AC ground bounce, and signal level translation. This universal approach allows the single-die circuit to accommodate various ground domain scenarios without requiring separate specialized circuits for each function.
2Reliability
If existing level shifter circuits are used, then signal translation is attempted, but they fail to tolerate DC or AC voltage differences between circuit grounds
Solution Approach 1:
The substrate bias circuit acts as an intermediary between the driver circuit and receiver circuit, actively managing voltage differences between ground domains. It monitors and adjusts substrate potential to accommodate both DC offsets and AC ground bounce, enabling reliable signal translation across incompatible ground domains without direct connection between the ground references.
Solution Approach 2:
The substrate bias circuit dynamically adjusts the substrate potential in response to varying voltage conditions between ground domains. It can adapt to changing DC offsets and AC ground bounce conditions in real-time, providing continuous reliability assurance rather than relying on fixed voltage level assumptions.
3Adaptability or versatility
If multiple dies are used to achieve ground domain translation, then signal translation across different grounds is possible, but cost and circuit complexity increase
Solution Approach 1:
The patent merges the driver circuit, receiver circuit, and substrate bias circuit onto a single semiconductor substrate, eliminating the need for multiple dies and their associated interconnect structures. This consolidation simplifies manufacturing processes, reduces assembly steps, and lowers overall production costs while maintaining full ground domain translation capability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables efficient signal transfer across ground domains with reduced circuit complexity and cost, while minimizing noise and damage from excessive voltage, ensuring reliable signal translation.
Implementation Method 1
A substrate bias circuit is coupled to the first ground terminal, the second ground terminal, and the semiconductor substrate. The substrate bias circuit minimizes a voltage difference between the first ground terminal and the second ground terminal by adjusting a voltage of the semiconductor substrate.
Data Source
AI summary
A circuit includes a semiconductor substrate, a first ground terminal, a second ground terminal, a driver circuit, a capacitor, a receiver circuit, and a substrate bias circuit. The driver circuit is on the semiconductor substrate. The driver circuit is coupled to the first ground terminal, and has a first output and a second output. The capacitor has a first terminal coupled to the first output of the driver circuit and a second terminal. The receiver circuit is on the semiconductor substrate. The receiver circuit is coupled to the second ground terminal, and has a first input coupled to the second terminal of the capacitor, and a second input coupled to the second output of the driver circuit. The substrate bias circuit has a first input coupled to the first ground terminal, a second input coupled to the second ground terminal, and an output coupled to the semiconductor substrate.