LGA Packaging Substrate Side Plating via Segmented Connecting Members
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Solution Overview
Problem
Current land grid array (LGA) packages cannot be subjected to side plating, limiting their use due to their multilayer material structure, which restricts their environmental friendliness and application in lead-free semiconductor packaging.
Innovation Solution
A packaging substrate design featuring a base substrate with solder pads on one surface and a metal layer with lead pads on the other, connected by a penetrating connecting member that allows for side plating after cutting, enabling the formation of a grid array package capable of side plating.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If LGA package uses multilayer material structure, then manufacturing complexity is reduced, but side plating capability is lost
Solution Approach 1:
The packaging substrate is divided into multiple packaging units separated by packaging lines. The connecting member extends across the packaging line, with portions on both sides, allowing the substrate to be segmented into individual units while maintaining electrical connectivity and enabling side plating on the exposed connecting member surfaces.
Solution Approach 2:
The connecting member is designed to extend not only vertically through the base substrate but also horizontally across the packaging line boundary. This dimensional extension creates exposed side surfaces that can be plated, transforming a traditionally bottom-only plating structure into one that supports side plating operations.
2Object-affected harmful factors
If LGA package uses traditional structure, then environmental friendliness is improved by using lead-free paste, but application scope is limited
Solution Approach 1:
The package structure supports multiple mounting and connection methods: traditional bottom soldering using lead-free paste for environmental compliance, and additional side plating capabilities that enable alternative connection methods and applications. This multi-functionality expands the适用范围 while maintaining environmental friendliness.
3Reliability
If connecting member is positioned entirely within packaging unit, then electrical connection is maintained, but side plating is prevented
Solution Approach 1:
The connecting member has different spatial configurations in different regions: within the packaging unit it maintains electrical connection, while across the packaging line it extends to create exposed side surfaces. This localized differentiation allows both electrical connectivity and side plating to coexist.
Data Source
AI summary
Disclosed are a packaging substrate, a grid array package, and a preparation method therefor. The packaging substrate comprises a plurality of packaging units, and each packaging unit is defined by a closed packaging line. The packaging substrate comprises: a base substrate having a first surface and a second surface that are opposite to each other, a plurality of solder pads provided on the first surface, and a metal layer provided on the second surface. In a given packaging unit, the metal layer comprises a plurality of lead pads, at least one lead pad extending from an inner side of the packaging unit defined by the packaging line to an outer side. The lead pad is connected to one solder pad by means of a connecting member penetrating through the base substrate, and an orthographic projection of the connecting member on the base substrate at least partially covers the packaging line.