Heat Dissipating Lid Groove for Warped Chip TIM Coverage
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Solution Overview
Problem
The high thermal resistance at the contact surface between solder thermal interface material and chips hinders effective heat dissipation, especially due to warping of chip wings during high-temperature processes, leading to incomplete coverage and increased thermal resistance.
Innovation Solution
A heat dissipating lid with a groove design on its surface, which stores excess solder thermal interface material during manufacturing, allowing it to flow and fill the warped chip regions under capillary action, ensuring complete coverage and reducing thermal resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If solder thermal interface material is used to cover the chip, then heat dissipation is implemented, but high thermal resistance occurs at the contact surface due to chip warping
Solution Approach 1:
The groove is pre-formed on the heat dissipating lid before the solder thermal interface material is applied. This preliminary structure prepares a designated path and storage area for the solder material, ensuring it can properly fill warped regions of the chip during subsequent thermal processing, thereby reducing contact surface thermal resistance
Solution Approach 2:
The groove acts as an intermediary structure between the heat dissipating lid and the chip. It stores excess solder thermal interface material and facilitates its flow to warped regions through capillary action, ensuring complete coverage and reducing thermal resistance at the contact interface
2Ease of manufacture
If high temperature processing is applied to the chip, then soldering is achieved, but chip wings warp causing incomplete coverage by thermal interface material
Solution Approach 1:
The groove design converts the harmful effect of chip warping during high-temperature soldering into a beneficial outcome. The warped regions create capillary channels that guide the molten solder thermal interface material from the groove to the chip surface, ensuring complete coverage after cooling
Solution Approach 2:
The invention utilizes the phase transition of solder thermal interface material from solid to liquid during high-temperature processing. The liquid state allows the material to flow into warped regions through capillary action, and subsequent cooling solidifies it to achieve complete coverage
3Reliability
If excess solder thermal interface material is used, then complete coverage is achieved, but material waste increases
Solution Approach 1:
The groove creates a localized storage area for excess solder thermal interface material. This local concentration ensures that material is available exactly where needed (warped regions) while preventing unnecessary material waste elsewhere, achieving complete coverage with optimized material usage
Solution Approach 2:
The groove is pre-formed to store the required amount of solder thermal interface material before application. This preliminary preparation ensures that excess material is contained and directed to specific areas needing coverage, preventing both waste and incomplete coverage
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The groove design facilitates full coverage of the chip surface by the solder thermal interface material, enhancing heat dissipation efficiency and reducing thermal resistance, thereby improving chip performance and longevity.
Implementation Method 1
a portion of the solder thermal interface material in a liquid state flows into the groove for storage
Implementation Method 2
the solder thermal interface material in the liquid state flows away from the wing region of the chip
Implementation Method 3
the solder thermal interface material stored in the groove flows to the first contact region and flows to a surface of the chip under the capillary flow action, and fills in the wing region of the chip
Data Source
AI summary
A heat dissipating lid includes a first surface configured to be connected to the chip, and a groove located on the first surface. The first surface includes a first contact region. In a chip package structure, a boundary of an orthographic projection of the chip on the first surface coincides with a boundary of the first contact region. The groove is located outside the first contact region and connected to the first contact region, and the groove extends along at least a portion of the boundary of the first contact region. The heat dissipating lid is applicable to the chip package structure and configured to dissipate heat for the chip.