Lid Structure Soldered Optical Fiber Alignment

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Solution Overview

Problem

In optical data communication systems, the attachment of optical fibers to photonic integrated circuit (PIC) chips using adhesives is prone to elastic and plastic deformation during high-temperature bonding processes, leading to misalignment and increased optical signal loss due to the adhesive's mechanical modulus reduction.

Innovation Solution

A package assembly and method that utilize a lid structure with soldered connections to securely hold optical fibers against the PIC chip's optical fiber attachment area, using soldered connections that withstand high temperatures and maintain mechanical force even after cooling, ensuring stable optical alignment.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If adhesive is used to attach optical fibers to PIC chip, then the attachment process is simple, but the adhesive undergoes elastic and plastic deformation during high-temperature bonding causing misalignment and increased optical signal loss

Engineering Contradiction:

Improveattachment process simplicityVSAvoidoptical alignment stability

Core Design Contradiction:

Ease of manufactureVSReliability

Solution Approach 1:

The patent extracts the optical fiber attachment function from the adhesive bonding process and implements it through a separate lid structure with a clamp mechanism. The lid structure is attached to the PIC chip independently, and its clamp portion secures the optical fiber without relying on adhesive bonding during high-temperature processes, thereby eliminating the deformation issue while maintaining manufacturing simplicity.

Inventive Principle:

Principle #2Taking out (Extraction)

Solution Approach 2:

The patent segments the attachment system into distinct functional components: the lid structure, the clamp portion, and the optical fiber. This segmentation allows the optical fiber to be held by the clamp mechanism rather than being bonded with adhesive, separating the fiber positioning function from the chip bonding process and preventing thermal deformation-induced misalignment.

Inventive Principle:

Principle #1Segmentation

2Strength

If high-temperature bonding process is used to attach lid structure to PIC chip, then strong mechanical bonding is achieved, but the adhesive's mechanical modulus reduces causing deformation and misalignment

Engineering Contradiction:

Improvebonding strengthVSAvoidoptical fiber alignment precision

Core Design Contradiction:

StrengthVSManufacturing precision

Solution Approach 1:

The patent applies beforehand cushioning by designing the lid structure with a clamp portion that pre-secures the optical fiber in the correct position before the high-temperature bonding process. The clamp acts as a protective mechanism that maintains optical alignment throughout the bonding process, preventing deformation and misalignment that would otherwise occur due to thermal effects on adhesive.

Inventive Principle:

Principle #11Beforehand cushioning (Prior cushioning)

3Device complexity

If adhesive is used to hold optical fiber, then the structure is simple, but the adhesive deforms under thermal stress leading to increased optical signal loss

Engineering Contradiction:

Improveattachment structure complexityVSAvoidoptical signal loss

Core Design Contradiction:

Device complexityVSLoss of energy

Solution Approach 1:

The patent introduces the lid structure with a clamp portion as an intermediary mechanism between the optical fiber and the PIC chip. This intermediary structure mechanically secures the optical fiber without relying on adhesive bonding, eliminating the thermal deformation issue that causes optical signal loss while maintaining structural simplicity through the integrated lid design.

Inventive Principle:

Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution provides reliable and sustainable optical fiber attachment, preventing deformation and maintaining optical alignment during high-temperature bonding processes, thus reducing optical signal loss and ensuring efficient data transmission.

Implementation Method 1

The plurality of soldered connections are configured to draw the lid structure toward the photonic integrated circuit chip so as to press the lid structure against the at least one optical fiber

Methodology Applied

Scientific EffectThermal contraction: Thermal Contraction

Implementation Method 2

The package assembly also includes a plurality of soldered connections that secure the lid structure to the photonic integrated circuit chip

Methodology Applied

Scientific EffectSoldering: Soldering

Data Source

PatentUS20230408767A1High-Temperature-Compatible Fiber Array Packaging Methods

Publication Date: 2023.12.21 AYAR LABS INC

AI summary

A package assembly includes a photonic integrated circuit chip that includes an optical fiber attachment area. The package assembly also includes at least one optical fiber positioned within the optical fiber attachment area. The package assembly also includes a lid structure disposed over the at least one optical fiber. The package assembly also includes a plurality of soldered connections that secure the lid structure to the photonic integrated circuit chip. The plurality of soldered connections are configured to draw the lid structure toward the photonic integrated circuit chip so as to press the lid structure against the at least one optical fiber to mechanically hold the at least one optical fiber against the optical fiber attachment area. The package assembly also includes a package component to which the photonic integrated circuit chip is flip-chip attached after formation of the plurality of soldered connections.