Lift Pin Pressure Control for Substrate Particle Adhesion
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Solution Overview
Problem
In substrate processing apparatuses, particle adhesion to substrates occurs due to friction between the substrate and the support during heating, which existing technologies fail to adequately prevent during the substrate removal process.
Innovation Solution
A substrate processing apparatus with a lift-pin mechanism that includes a pressure regulator to adjust the pressure in holes beneath the substrate to a lifting pressure greater than or equal to the processing space pressure, ensuring the substrate remains mounted and minimizing particle adhesion during removal.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the substrate is heated during processing, then the substrate can be processed, but friction between the substrate and support generates particles that adhere to the substrate
Solution Approach 1:
The patent applies pneumatic pressure through a lift pin mechanism to lift the substrate slightly during removal. A pressure regulator controls the pressure in the hole to create a lifting force that separates the substrate from the support surface, reducing friction and particle generation during the removal process
2Object-generated harmful factors
If the substrate is moved diagonally upward to eliminate friction, then particle generation is suppressed, but the substrate may detach from the support during lifting
Solution Approach 1:
The patent changes the pressure parameter in the hole to a lifting pressure that is greater than or equal to the processing space pressure. This pressure adjustment creates a controlled lifting force that reduces friction and particle generation while maintaining substrate mounting stability through continuous contact with the support
3Force
If the pressure in the hole is increased to lift the substrate, then friction is reduced, but the substrate may detach from the mounting surface
Solution Approach 1:
The patent precisely controls the pressure parameter in the hole to be greater than or equal to the processing space pressure but not excessive. This optimized pressure setting generates sufficient lifting force to reduce friction and particle adhesion while maintaining continuous substrate mounting on the support surface
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The apparatus effectively prevents particle adhesion to the substrate by maintaining a minutely positive pressure differential, allowing smooth substrate separation and reducing particle flying up during lifting.
Implementation Method 1
a pressure regulator that regulates the pressure in the hole by passing inert gas through the pin housing chamber
Implementation Method 2
the pressure regulator adjusts the pressure in the hole to a lifting pressure that is greater than or equal to the pressure in a processing space
Data Source
AI summary
A substrate-processing-apparatus includes a processing-vessel to accommodate a substrate and to process the substrate; a substrate-support that is provided inside the processing-vessel and has a mounting-surface on which the substrate is mounted; and a lift-pin-mechanism that includes a lift-pin that is movable relative to the substrate-support and a pin-housing-chamber in which the lift-pin is housed, the lift-pin-mechanism being to lift the substrate by raising the lift-pin, wherein the substrate-support has a hole through which the lift-pin is passable, the lift-pin mechanism includes a pressure-regulator that regulates the pressure in the hole by passing inert-gas through the pin-housing-chamber, and at a timing when the substrate is to be lifted, the pressure-regulator adjusts the pressure in the hole to a lifting pressure that is greater than or equal to the pressure in a processing space that is above the mounting-surface and at which the substrate remains continuously mounted on the mounting-surface.