Light Detector Package Structure With Cap-Mounted Optical Filters
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Solution Overview
Problem
The existing manufacturing method for light detecting modules is inefficient due to defects in the light filtering film coating process, leading to the discarding of otherwise functional photosensitive dies and increased production costs.
Innovation Solution
A package structure and method where light filtering films are mounted on a sealing cap, which is then positioned over packaged light detecting components on a circuit board, ensuring that any defects in the filtering films do not affect the components and allowing for the use of otherwise fine light detecting components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the light filtering film is coated directly on the photosensitive die, then the light detecting module can measure different frequency bands of light, but any defect in the photosensitive film during the coating process causes the photosensitive die to be discarded even though the photosensitive die itself is fine, leading to increased manufacture cost
Solution Approach 1:
The patent separates the light filtering film from the photosensitive die by mounting the filtering film on a transparent substrate (sealing cap) rather than coating it directly on the die. This segmentation allows the photosensitive die and light filtering film to be manufactured and inspected independently, so that a defective filtering film does not cause the photosensitive die to be discarded.
Solution Approach 2:
The patent introduces a transparent substrate (sealing cap) as an intermediary between the light filtering film and the photosensitive die. The filtering film is mounted on this substrate, which then positions the film in front of the die without direct contact. This intermediary structure allows the filtering film to be replaced or repaired without damaging the photosensitive die.
2Device complexity
If the light filtering film is coated directly on the photosensitive die, then the structure is compact, but the photosensitive die must be discarded when the filtering film is defective, reducing productivity
Solution Approach 1:
By segmenting the light filtering film from the photosensitive die and mounting it on a separate transparent substrate, the patent enables independent inspection and replacement of the filtering film. This reduces waste of functional photosensitive dies and improves production efficiency despite the slightly increased structural complexity.
3Ease of manufacture
If the light filtering film is coated directly on the photosensitive die, then the coating process is simple, but defects cause functional dies to be discarded, increasing loss of substance
Solution Approach 1:
The patent segments the light filtering film from the photosensitive die by mounting the film on a transparent substrate. This allows the filtering film to be manufactured, inspected, and replaced independently, preventing the loss of functional photosensitive dies when filtering film defects occur during or after the coating process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces manufacturing costs by preventing the discard of functional light detecting components and ensures accurate filtering of incident light beams, enhancing the efficiency of the light detection process.
Implementation Method 1
The light filtering films are mounted on the first surface of the sealing cap, and a projection of each light filtering film on the mounting surface of the circuit board corresponds to a respective one of the packaged light detecting components
Data Source
AI summary
The package structure having packaged components within includes a circuit board, multiple packaged light detecting components mounted on the circuit board, a sealing cap being light transmittable, multiple light filtering films mounted on the sealing cap, and a supporting annular wall. The two opposite ends of the supporting annular wall are adhesively bonded to the surfaces of the circuit board and the sealing cap, such that the projection on the circuit board of the light filtering films corresponds the packaged light detecting components. Since the light filtering films have different filtering frequency bands, each packaged light detecting component detects light of different frequency bands in one incident light beam. The package method is simple and stable, effectively lowering the manufacture cost of the light detecting module.