Light Emitting Element Insulation for Etch-Safe Separation

Resolve Bottlenecks,
Find Innovative SolutionsGenerate Solutions

Solution Overview

Problem

Inorganic light emitting diodes face challenges during manufacturing due to damage of insulating material layers on their outer surfaces when using chemical separation methods, leading to potential defects and performance issues.

Innovation Solution

A manufacturing method involving the formation of a light emitting element with a protective insulating layer system, where a first insulating layer and a second insulating layer with different etch selectivities are used to prevent damage from etchants, ensuring a flat and parallel parting surface and maintaining the integrity of the insulating material layers.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If a chemical method is used to separate the light emitting element, then the separation process is effective, but the insulating material layer surrounding the outer surface is partially damaged

Engineering Contradiction:

Improveseparation process effectivenessVSAvoidinsulating material layer integrity

Core Design Contradiction:

Ease of manufactureVSManufacturing precision

Solution Approach 1:

A protective layer is formed on the insulating material layer before the chemical separation process. This preliminary protective coating prevents the etchant from damaging the insulating material layer during separation, while still allowing the separation to proceed effectively. The protective layer is removed after separation completes its function.

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The protective layer acts as an intermediary between the etchant and the insulating material layer. It temporarily protects the insulating material from direct contact with the harmful etchant during the separation process, enabling both effective separation and preservation of the insulating layer.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Manufacturing precision

If the insulating material layer is protected during separation, then manufacturing precision is improved, but the device complexity increases due to additional protective layers

Engineering Contradiction:

Improveinsulating material layer integrityVSAvoidprotective layer structure

Core Design Contradiction:

Manufacturing precisionVSDevice complexity

Solution Approach 1:

The protective layer is designed with specific material properties that allow it to be selectively removed after serving its protective function. By changing the chemical composition and etch selectivity parameters of the protective layer, it can be easily removed without damaging the underlying insulating material layer, thus reducing complexity after the critical separation step.

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The protective layer is a temporary component that is discarded after completing its protective function during separation. This temporary protective measure allows the insulating material layer to be preserved during the critical separation process, while the protective layer itself is removed and discarded in a subsequent step, preventing permanent increase in device complexity.

Inventive Principle:

Principle #34Discarding and recovering

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The method effectively protects the insulating material layers, preventing damage during the separation process and ensuring the light emitting element's reliability by maintaining a flat and parallel surface, which helps in preventing open or short circuit issues in the display device.

Implementation Method 1

etching and removing the separating layer by an etchant for separation containing fluorine (F)

Methodology Applied

Scientific EffectChemical etching:

Implementation Method 2

the second insulating layer may have an etch selectivity with respect to the etchant, which is greater than an etch selectivity of the separating layer with respect to the etchant

Methodology Applied

Scientific EffectEtch selectivity:

Data Source

PatentUS11810905B2Light emitting element, manufacturing method thereof, and display device including the light emitting element

Publication Date: 2023.11.07 SAMSUNG DISPLAY CO LTD

AI summary

Provided are a light emitting device, a method for manufacturing same, and a display device including the light emitting device. The method for manufacturing the light emitting device comprises the steps of: preparing a lower substrate including a substrate and a buffer semiconductor layer formed on the substrate, forming an element rod by forming a separating layer disposed on the lower substrate, forming a first conductivity type semiconductor layer, an active material layer, and a second conductivity type semiconductor layer on the separating layer, and etching the first conductivity type semiconductor layer, the active material layer, the second conductivity type semiconductor layer, and the separating layer in a direction perpendicular to the lower substrate, forming a first insulating layer surrounding an outer circumferential surface of the element rod, forming a second insulating layer surrounding an outer circumferential surface of the first insulating layer and separating the element rod from the lower substrate to form a light emitting element.