Light Emitting Element Attachment Using a Dried Insulation Layer

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Solution Overview

Problem

The existing manufacturing methods for electronic devices with light emitting elements face challenges in achieving proper alignment and reliable attachment, leading to inconsistent light emission and reduced manufacturing yield due to the use of separate adhesives that can introduce bubbles and lower encapsulation performance.

Innovation Solution

A method involving the use of an ultraviolet curable tape as a transport layer, where a polyimide-based insulation layer is coated and dried to attach the light emitting element to the circuit layer, eliminating the need for separate adhesives and enhancing adhesion, thereby ensuring precise alignment and improved reliability.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If a separate adhesive is used to attach the light emitting element to the circuit layer, then the attachment process is simplified, but the encapsulation performance deteriorates due to bubbles and reduced reliability

Engineering Contradiction:

Improveattachment process simplicityVSAvoidencapsulation performance

Core Design Contradiction:

Ease of manufactureVSReliability

Solution Approach 1:

The patent merges the adhesive layer and encapsulation layer into a single integrated insulating layer. This layer simultaneously provides attachment functionality (bonding the light emitting element to the circuit layer) and encapsulation functionality (protecting the interface without introducing bubbles). The insulating layer is formed to cover both the circuit layer and light emitting element, creating a unified structure that eliminates the need for separate adhesive and encapsulation materials.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The patent extracts the harmful adhesive material from the structure and replaces it with the insulating layer that already exists in the device architecture. By removing the separate adhesive layer and using only the insulating layer for both attachment and encapsulation, the source of bubbles and reliability issues is eliminated while maintaining manufacturing simplicity.

Inventive Principle:

Principle #2Taking out (Extraction)

2Productivity

If proper alignment of the light emitting element on the electrode is not achieved, then the manufacturing process is faster, but the light emission function deteriorates

Engineering Contradiction:

Improvemanufacturing speedVSAvoidlight emission function

Core Design Contradiction:

ProductivityVSReliability

Solution Approach 1:

The patent performs preliminary alignment by disposing the light emitting element on the insulating layer before the insulating layer is fully dried. The insulating layer is then dried to attach the light emitting element to the circuit layer. This preliminary positioning allows for easy adjustment and alignment before the final bonding occurs, ensuring proper alignment without sacrificing manufacturing speed.

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The insulating layer serves as an intermediary that facilitates both alignment and attachment. During the drying process, the insulating layer transitions from a state that allows movement/alignment to a state that provides strong bonding. This intermediary role of the insulating layer enables proper alignment to be achieved while maintaining manufacturing efficiency.

Inventive Principle:

Principle #24Intermediary (Mediator)

3Productivity

If the insulating layer is not dried sufficiently, then the attachment process is faster, but the adhesion strength deteriorates

Engineering Contradiction:

Improvedrying process timeVSAvoidadhesion strength

Core Design Contradiction:

ProductivityVSStrength

Solution Approach 1:

The patent controls the drying parameters (temperature, time, humidity) of the insulating layer to achieve optimal adhesion strength. By carefully adjusting these parameters, the insulating layer reaches the appropriate level of dryness that provides strong bonding between the light emitting element and circuit layer without requiring excessive drying time that would reduce productivity.

Inventive Principle:

Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach improves the adhesion and attachment of light emitting elements to the circuit layer, reducing the risk of bubbles and enhancing the encapsulation performance, resulting in improved reliability and manufacturing yield of electronic devices.

Implementation Method 1

the transport layer may be an ultraviolet curable tape, and the detaching of the light emitting element may include irradiating the transport layer with an ultraviolet ray

Methodology Applied

Scientific EffectUltraviolet curing: Photopolymerisation

Implementation Method 2

drying the insulation layer to attach the light emitting element with the insulating layer and the circuit layer

Methodology Applied

Scientific EffectEvaporation: Evaporation

Data Source

PatentUS20250015096A1Electronic device, manufacturing method of electronic device, and method for attaching a light emitting element to a substrate

Publication Date: 2025.01.09 SAMSUNG DISPLAY CO LTD

AI summary

Provided is a manufacturing method of an electronic device, including forming a circuit layer on a base layer, disposing a light emitting element for attachment over the circuit layer, disposing an insulating layer between the light emitting element and the circuit layer, and drying the insulation layer to attach the light emitting element with the insulating layer and the circuit layer.