Light Emitting Element Insulating Stack for Short-Circuit Reliability
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Solution Overview
Problem
Current light emitting elements face reliability issues due to surface defects and electrical short circuits, which affect their lifetime and efficiency, especially when densely packed in display devices.
Innovation Solution
A light emitting element with a multi-layer insulating film structure, including layers of zirconium oxide, silicon oxide, and aluminum nitride, is used to surround the light emitting stack pattern, reducing surface defects and preventing short circuits by using materials like zirconium oxide, hafnium oxide, and aluminum nitride with specific thicknesses to enhance the protective layer characteristics.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If a single-layer insulating film is used, then the structure is simple, but surface defects occur and electrical short circuits happen
Solution Approach 1:
The insulating film is divided into multiple layers (first insulating layer, second insulating layer, third insulating layer) with different materials and functions. Each layer addresses specific issues: the first layer provides baseline insulation, the second layer prevents electrical short circuits between adjacent elements, and the third layer reduces surface defects. This segmentation resolves the contradiction by achieving high reliability through functional division while maintaining reasonable structural complexity.
Solution Approach 2:
The patent employs a composite insulating film structure using different materials for each layer. The first insulating layer uses a material with appropriate dielectric properties, the second layer uses a material optimized for preventing short circuits, and the third layer uses a material effective for surface defect reduction. This composite approach allows each layer to contribute its specific strengths, achieving high reliability without requiring excessive structural complexity.
2Reliability
If insulating film thickness is increased, then electrical short circuit prevention improves, but manufacturing precision requirements increase
Solution Approach 1:
Instead of using a single thick insulating layer that would demand high thickness precision, the patent segments the insulation function across three layers with different thicknesses. The second layer provides the primary short circuit prevention with adequate thickness, while the first and third layers add protective functions with smaller thickness variations. This segmentation reduces the overall manufacturing precision burden while maintaining effective short circuit prevention.
Solution Approach 2:
The patent optimizes the thickness parameters of each insulating layer individually rather than requiring uniform high precision across a single thick layer. By distributing the total insulation requirement across multiple layers with different thickness specifications, the patent achieves effective short circuit prevention while relaxing the overall manufacturing precision requirements. Each layer's thickness can be controlled within practical manufacturing tolerances.
Data Source
AI summary
A light emitting element may include a light emitting stack pattern including a first semiconductor layer, an active layer, and a second semiconductor layer. An insulating film may surround an outer circumferential surface of the light emitting stack pattern. The insulating film may include a first layer, a second layer surrounding the first layer, and a third layer surrounding the second layer. The first layer and the third layer may include a same material.