Light-Emitting Arrangement With Deflection Element For Heat Dissipation
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing light-emitting arrangements face challenges in achieving long life and simplicity in production, particularly due to limitations with radiation-sensitive conversion materials that are prone to aging and inefficiencies in heat dissipation and light distribution.
Innovation Solution
A light-emitting arrangement featuring a radiation-emitting semiconductor chip, a laterally arranged first conversion element that absorbs and emits secondary radiation, and a deflection element that directs primary radiation onto the conversion element, allowing for improved heat dissipation and light distribution without direct contact, using a well-conductive carrier and encapsulation to protect the conversion element.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conversion elements are arranged directly next to the radiation-emitting semiconductor chip, then light conversion efficiency is improved, but the conversion elements are exposed to high temperatures and harmful radiation causing aging and reduced reliability
Solution Approach 1:
A light guide is introduced as an intermediary component between the radiation-emitting semiconductor chip and the conversion elements. The light guide receives radiation from the chip, transports it through its structure, and directs it to the conversion elements, thereby isolating the conversion elements from direct exposure to high temperatures and harmful radiation while maintaining efficient light conversion
Solution Approach 2:
The arrangement transitions from a direct lateral placement to a three-dimensional configuration where conversion elements are positioned at the end face of the light guide, utilizing the light guide's internal structure to spatially separate the radiation source from the conversion elements while maintaining optical coupling
2Temperature
If conversion elements are spaced apart laterally, then heat dissipation is improved, but the light distribution and conversion efficiency are reduced
Solution Approach 1:
The light guide acts as a mediator that collects radiation from the semiconductor chip and distributes it to multiple conversion elements spaced apart at its end face, maintaining both thermal separation for heat dissipation and optical coupling for efficient light conversion
Solution Approach 2:
The light guide's end face is divided into multiple regions, each coupled with a separate conversion element, allowing independent thermal management while maintaining overall light conversion efficiency through the segmented arrangement
3Ease of manufacture
If a simple production method is used, then manufacturing complexity is reduced, but precision in positioning and alignment of components is compromised
Solution Approach 1:
The light guide serves multiple functions simultaneously: it acts as a radiation transport medium, a positioning structure for conversion elements, and a thermal management component, thereby simplifying the overall production process while maintaining manufacturing precision through a single integrated component
Solution Approach 2:
The light guide and the positioning structure are merged into a single component, eliminating the need for separate alignment fixtures and reducing the number of assembly steps while ensuring precise positioning of conversion elements relative to the radiation source
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables the use of sensitive conversion materials, enhancing the light-emitting arrangement's lifespan and efficiency by improving heat dissipation and light spreading, while maintaining protection against humidity and atmospheric gases.
Implementation Method 1
a first conversion element that absorbs part of the primary radiation and emits secondary radiation
Implementation Method 2
a first conversion element that absorbs part of the primary radiation and emits secondary radiation
Implementation Method 3
a deflection element that causes a direction change for part of the primary radiation
Implementation Method 4
a deflection element that causes a direction change for part of the primary radiation
Implementation Method 5
using a well-conductive carrier
Data Source
AI summary
A method of producing a light-emitting arrangement includes providing a carrier including a top side, attaching a multitude of first conversion elements on the top side of the carrier, wherein the first conversion elements are arranged in a lateral direction spaced apart from one another, attaching an encapsulation on the top side of the carrier, wherein the encapsulation covers the carrier and the first conversion elements at least sectionally, removing the encapsulation in regions between the first conversion elements, and attaching optoelectronic semiconductor chips between the first conversion elements.