Light Emitting Device Alignment via Shielding Layer and Collimator
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Solution Overview
Problem
Infrared light emitting modules used in 3D face recognition devices often suffer from misalignment due to improper adhesive application, leading to light deviation and errors in image processing.
Innovation Solution
A light emitting device design featuring a substrate with a light emitting element embedded in a groove, a shielding layer with openings exposing the element, and a collimator with convex portions or lenses aligned with the openings, along with a manufacturing method that includes forming a shielding layer and adhering a collimator to improve alignment and reduce light interference.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If adhesive is used to bond the substrate, collimator lens, and diffractive optical element, then the components can be assembled, but misalignment occurs due to improper adhesive application or curing abnormalities
Solution Approach 1:
The patent introduces a positioning structure as an intermediary component between the substrate and the optical elements (collimator lens and diffractive optical element). This positioning structure serves as a mediator that ensures precise alignment during assembly, eliminating the alignment errors that would otherwise be caused by improper adhesive application or curing issues. The positioning structure translates the assembly process into a more controlled operation where components are first positioned accurately and then bonded.
Solution Approach 2:
The patent implements preliminary positioning of the collimator lens and diffractive optical element relative to the substrate before the adhesive bonding process. The positioning structure is designed to pre-establish the correct spatial relationships and alignment of all optical components. This preliminary action ensures that even if adhesive application or curing later causes slight shifts, the initial precise positioning is maintained, preventing misalignment and light deviation.
2Measurement precision
If the light emitting element, collimator lens, and diffractive optical element are precisely aligned, then light emission accuracy is improved, but the device structure becomes more complex
Solution Approach 1:
The patent merges the positioning function with the substrate structure itself. Instead of adding completely separate positioning mechanisms, the positioning structures are integrated into the substrate design, allowing precise alignment of optical elements while maintaining a compact and relatively simple overall device structure. This merging approach achieves high light emission accuracy without proportionally increasing device complexity.
3Ease of operation
If traditional adhesive bonding is used, then assembly is simple, but light deviation occurs resulting in image processing errors
Solution Approach 1:
The positioning structure acts as an intermediary that bridges the gap between simple adhesive bonding and reliable light emission. It provides a mechanical framework that guides and constrains the optical elements during assembly, ensuring they remain in the correct positions. This intermediary structure maintains the simplicity of the adhesive bonding process while dramatically improving the reliability of light emission by preventing misalignment and subsequent image processing errors.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution ensures precise alignment and collimation of light, enhancing the accuracy and efficiency of light emission for 3D face recognition applications while improving heat dissipation and reducing device thickness.
Implementation Method 1
a collimator lens... In order to emit collimated light without deviating
Data Source
AI summary
A light emitting device includes a substrate, a light emitting element, a shielding layer, and a collimator. The light emitting element is embedded in the substrate. The shielding layer is disposed on the substrate and has an opening exposing the light emitting element. The collimator is disposed on the shielding layer.