Light-Emitting Module with Laser-Formed Insulating Holes
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Solution Overview
Problem
Current light-emitting modules are not designed to be compact, and there is a need for a smaller form factor while maintaining stable electrical connections and high productivity in manufacturing.
Innovation Solution
A light-emitting module design featuring a light-emitting device with a semiconductor stacked body, a resin member, and a conductive layer, integrated with an optical member and insulating member, where a wiring member is connected to the conductive layer through holes formed in the insulating member using laser irradiation, allowing for a smaller size and stable electrical connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the light-emitting module is reduced in size, then the compactness is improved, but the electrical connection stability deteriorates
Solution Approach 1:
The patent combines the conductive layer and insulating member into a single integrated structure. The conductive layer is formed to extend onto the insulating member, creating a unified component that provides both electrical connection and insulation functions, thereby maintaining connection stability in a compact space
Solution Approach 2:
The conductive layer is designed to extend in multiple dimensions - covering not only the electrode surface but also extending onto the side surface of the insulating member. This multi-dimensional extension ensures reliable electrical connection while accommodating the compact module structure
2Productivity
If traditional wiring methods are used, then the manufacturing process is simple, but the productivity is low
Solution Approach 1:
The patent replaces traditional mechanical wiring methods with laser irradiation to form holes through the insulating member. This laser-based approach enables precise, automated hole formation without mechanical contact, significantly improving manufacturing productivity and enabling compact design
Solution Approach 2:
The manufacturing process utilizes laser parameters (energy, duration, focal point) to precisely control hole formation depth and position. By adjusting laser irradiation parameters, the process achieves high-precision hole formation rapidly, improving both productivity and connection reliability
3Reliability
If the conductive layer is extended onto the insulating member, then the contact resistance is reduced, but the short-circuit risk increases
Solution Approach 1:
The conductive layer is designed with spatially varying properties - it extends onto the insulating member only in specific regions where electrical connection is needed, while maintaining insulation in other areas. This localized conductivity extension reduces contact resistance at connection points without creating short-circuit pathways
Solution Approach 2:
The insulating member serves as an intermediary between the conductive layer and other electrical components. By carefully controlling where the conductive layer contacts the insulating member, the design uses this intermediary structure to achieve low contact resistance while preventing short-circuits through proper insulation positioning
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables the creation of a smaller light-emitting module with stable electrical connections and high manufacturing productivity, reducing the risk of short-circuits and improving contact resistance.
Implementation Method 1
forming a hole reaching the conductive layer by irradiating laser light on the insulating member
Data Source
AI summary
A light-emitting module includes an optical member including a first major surface, and a second major surface; a light-emitting device bonded to the first major surface, the light-emitting device including a light-emitting element including a major light-emitting surface, an electrode surface, and an electrode disposed at the electrode surface, a resin member covering a side surface of the light-emitting element, and a conductive layer disposed continuously on the electrode and on the resin member; an insulating member covering the first major surface of the optical member, a side surface of the light-emitting device, and a portion of the conductive layer of the light-emitting device; and a wiring member disposed on the insulating member and electrically connected to the conductive layer.