Light-Emitting Substrate Assembly With Variable-Thickness Polymer Bonding
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Solution Overview
Problem
Existing electronic devices face challenges in extending their operating service life and improving packaging techniques, particularly in maintaining reliability and reducing defects such as air gaps between substrates, which can lead to premature failure.
Innovation Solution
The electronic device design incorporates a first substrate with light-emitting units, a second substrate opposite to the first, and a polymer element between them, where the polymer element has varying thicknesses to enhance adhesion and reduce air gaps, using a transparent material layer and a sealing material with controlled viscosity and hardness to ensure robust assembly.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a uniform thickness polymer element is used between substrates, then the manufacturing process is simple, but air gaps form between substrates reducing reliability
Solution Approach 1:
The polymer element is designed with non-uniform thickness where the first portion (overlapping light-emitting units) has a first thickness and the second portion (in non-light-emitting region) has a second thickness greater than the first. This local variation in thickness provides enhanced adhesion at critical areas while maintaining overall structural integrity, preventing air gaps without requiring complete complexity throughout the entire device.
2Reliability
If the polymer element thickness is increased to reduce air gaps, then adhesion improves, but the device volume increases
Solution Approach 1:
The polymer element implements local quality by having different thicknesses in different regions: the first portion overlapping the light-emitting units has a smaller first thickness, while the second portion in the non-light-emitting region has a larger second thickness. This approach concentrates the adhesion-enhancing thickness where it is most needed (at the periphery and in non-light-emitting regions) while minimizing the thickness in the light-emitting region to reduce overall device volume and maintain light emission efficiency.
Data Source
AI summary
An electronic device having a first light-emitting region, a second light-emitting region and a non-light-emitting region, comprising a first substrate body, a first light emitting unit, a second light emitting unit, a second substrate body and a first polymer element. The first light emitting unit is disposed on the first substrate body and in the first light-emitting region. The second light emitting unit is disposed on the first substrate body and in the second light-emitting region. The second substrate body is opposite to the first substrate body. The first polymer element is disposed between the first light-emitting unit and the second substrate body. The first polymer element has a first portion overlapping the first light-emitting unit and a second portion in the non-light-emitting region, and a thickness of the first portion of the first polymer element is less than a thickness of the second portion of the first polymer element.