Light-Emitting Device Resin Structure for Higher Light Extraction
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Solution Overview
Problem
Existing methods for manufacturing light-emitting devices struggle to achieve good light emission characteristics, as they often result in devices with poor light extraction efficiency and high optical losses.
Innovation Solution
A method for manufacturing a light-emitting device that involves a substrate with positive and negative wiring parts, a light source part with semiconductor structures and electrode parts, and a resin part with a light-reflecting and light-absorbing component to enhance light emission and reduce optical losses.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If conventional manufacturing methods are used for light-emitting devices, then the manufacturing process is simple, but the light extraction efficiency is poor and optical losses are high
Solution Approach 1:
The resin part is divided into multiple functional regions: a light-reflecting part with high reflectivity and a light-absorbing part with high absorbance. This segmentation allows different portions of the resin to perform specialized optical functions, reducing overall optical losses by directing light effectively and absorbing stray light that would otherwise cause interference or loss.
Solution Approach 2:
Different regions of the resin part are assigned different optical properties: the light-reflecting part has high reflectivity to bounce light back toward the light-emitting parts, while the light-absorbing part has high absorbance to capture stray light. This local differentiation of material properties optimizes light extraction efficiency in specific areas without requiring complete structural redesign.
2Illumination intensity
If conventional resin materials are used, then the manufacturing process is simple, but the light emission characteristics are poor
Solution Approach 1:
The resin part is formulated as a composite material containing both light-reflecting components (such as titanium oxide or barium sulfate) and light-absorbing components (such as carbon black or iron oxide). This composite structure enables the single resin part to simultaneously provide light reflection, light absorption, and light emission enhancement functions, improving light extraction efficiency without adding separate structural components.
3Loss of energy
If the element substrate is removed after resin disposal, then the light extraction efficiency improves, but the structural stability may be compromised
Solution Approach 1:
The resin part acts as an intermediary between the light-emitting parts and the substrate. It provides mechanical support and structural stability while simultaneously performing optical functions (reflection, absorption, and emission enhancement). The resin part maintains the positional relationship between components and ensures structural integrity even when the element substrate is removed, preventing direct contact between the semiconductor structure and substrate that could cause damage.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The proposed method enables the production of light-emitting devices with improved light emission characteristics, including increased light extraction efficiency and high contrast ratios, due to the strategic use of resin parts with high reflectivity and absorptivity.
Implementation Method 1
a light-absorbing part disposed on the light-reflecting part, the light-absorbing part having a light absorbance higher than that of the light-reflecting part
Implementation Method 2
a light-reflecting part having high light reflectivity
Data Source
AI summary
A method for manufacturing a light-emitting device includes: providing a structure including: a substrate including a plurality of positive and negative wiring parts at an upper surface of the substrate, and a light source part disposed on the substrate, the light source part including: an element substrate, and a plurality of light-emitting parts, each of the light-emitting parts including: a semiconductor structure including a first surface facing the element substrate and a second surface positioned at a side opposite to the first surface, and positive and negative electrode parts disposed on the second surface of the semiconductor structure; providing a mold including an upper mold and a lower mold; disposing a first resin part between the upper surface of the substrate and the second surfaces of the semiconductor structures; and removing the element substrate from the light source part.