Light-emitting unit with third pad interconnection

The patent merges the interconnection function into the mounting substrate itself by forming conductive pads directly on the substrate surface. Multiple light-emitting elements are connected to adjacent pads on the same substrate, eliminating the need for separate bonding wires and wiring layers, thus reducing spacing requirements and package size.

The patent extracts the interconnection function from traditional bonding wires and wiring layers, and relocates it to the mounting substrate through directly formed conductive pads. This separation allows the interconnection structure to be integrated into the substrate fabrication process rather than requiring additional assembly steps.

The patent combines the pad formation process with the mounting substrate fabrication process. Conductive pads are formed directly on the substrate using standard semiconductor manufacturing techniques, integrating multiple functions into a single fabrication sequence and reducing overall manufacturing complexity and cost.

The patent uses a simple, planar pad structure that can be easily fabricated using standard semiconductor processes. This approach replaces expensive and complex three-dimensional interconnection structures with a simpler, more cost-effective two-dimensional pad layout that is easier to manufacture at scale.

The patent inverts the traditional approach by making the mounting substrate itself conductive rather than using non-conductive substrates with added wiring. This allows the substrate to directly provide both mechanical support and electrical interconnection, eliminating the need for additional bonding/soldering space.

The conductive pads on the mounting substrate serve as intermediaries between the light-emitting elements and the external circuitry. These pads provide both mechanical attachment points and electrical connection points, consolidating two functions into a single structure and reducing spacing requirements.