Light-Emitting Module Recess Structure for Resin Positioning
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Solution Overview
Problem
Existing light-emitting modules face challenges in controlling the positioning of covering resins on lateral surfaces, leading to potential coverage of light-emitting surfaces and reduced luminous efficiency.
Innovation Solution
A light-emitting module design featuring a light-reflecting part with recessed portions on its lower surface, allowing the covering resin to be spaced apart and positioned easily, preventing coverage of the light-transmitting part and enhancing light emission in lateral directions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If a light-reflecting covering resin is disposed on the substrate to cover lateral surfaces, then luminous efficiency is improved, but the positioning control of the covering resin becomes difficult
Solution Approach 1:
The light-reflecting part is divided into multiple regions: a first light-reflecting part covering the lateral surfaces and a second light-reflecting part covering the lower surface. This segmentation allows the covering resin to be positioned in the recessed portion without interfering with the light-emitting function, while still achieving effective coverage of lateral surfaces for improved luminous efficiency.
Solution Approach 2:
The invention introduces a vertical dimension by forming a recessed portion in the lower surface of the light-reflecting part. This allows the covering resin to be disposed below the level of the light-transmitting part, separating the resin positioning function from the light emission function in the vertical direction, thereby solving the positioning control problem while maintaining lateral surface coverage.
2Loss of energy
If the covering resin is disposed around the light emitting device, then lateral surfaces are covered, but the light-transmitting part may be covered causing brightness loss
Solution Approach 1:
By forming a recessed portion in the lower surface, the invention creates a vertical separation between the covering resin and the light-transmitting part. The covering resin is disposed in the recessed portion at a lower level, while the light-transmitting part remains at a higher level, ensuring that the resin does not cover the light-emitting surface and brightness is maintained.
Solution Approach 2:
The light-reflecting part has different properties in different regions: the first light-reflecting part covers lateral surfaces to reflect light back, while the second light-reflecting part covers the lower surface. The recessed portion is specifically designed in the second light-reflecting part to accommodate the covering resin, allowing each region to fulfill its specific function without interfering with others.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enables precise control of the covering resin's placement, reducing brightness loss and achieving high-intensity light emission with predetermined light distribution properties.
Implementation Method 1
a light-reflecting part having a lower surface and covering at least the lateral surfaces and the lower surface of the semiconductor layered structure
Implementation Method 2
a light-transmitting part on the light-reflecting part and covering an upper surface side of the semiconductor layered structure
Data Source
AI summary
A light emitting module includes a substrate; at least one light emitting device each including: at least one light emitting element each including: a semiconductor layered structure having a lower surface, an upper surface, and lateral surfaces, and electrodes on the lower surface of the semiconductor layered structure; a light-reflecting part having a lower surface and covering at least the lateral surfaces and the lower surface of the semiconductor layered structure, at least one recessed portion being formed in the lower surface of the light-reflecting part; and a light-transmitting part located over the light-reflecting part and covering an upper surface side of the semiconductor layered structure; an electrically conductive bonding member configured to bond the substrate and the electrodes of each of the at least one light emitting device; and a covering resin spaced apart from the light-transmitting part and disposed at least in the at least one recessed portion and around at least one of the at least one light emitting device.