Light Emitting Package Structure for Uniform Color Output

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Solution Overview

Problem

Conventional light emitting packages suffer from non-uniform color emission due to differences in light color passing through the upper and side surfaces, primarily due to the structure of the phosphor layer surrounding the light emitting diode, limiting their application in areas requiring consistent illumination.

Innovation Solution

A light emitting package design featuring a substrate with a circuit pattern, a first optic layer, a light controller, and a second optic layer, where the first optic layer generates light and the light controller reflects side-emitted light to ensure uniform color emission across the entire surface, utilizing an optical characteristic converter to adjust light wavelengths and a separation layer to enhance light extraction from the side surfaces.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Illumination intensity

If a conventional light emitting package uses a phosphor layer surrounding the LED, then light emission is achieved, but color uniformity deteriorates due to differences in light color passing through upper and side surfaces

Engineering Contradiction:
Improvelight emissionVSAvoidcolor uniformity
Core Design Contradiction:
Illumination intensityVSManufacturing precision

Solution Approach 1:

The patent extracts the phosphor layer from the conventional surrounding structure and places it only on the upper surface of the LED chip. This extraction eliminates the cause of color non-uniformity (phosphor on side surfaces) while preserving the beneficial light conversion function on the upper surface. The side surfaces thus emit original LED color light while the upper surface emits converted color light, achieving overall color uniformity.

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The patent applies different optical characteristics to different regions: the upper surface has a phosphor layer for wavelength conversion, while the side surfaces have no phosphor layer to maintain original LED color. This local differentiation ensures that both upper and side surfaces emit light of consistent color, resolving the color uniformity issue.

Inventive Principle:
Principle #3Local quality

2Manufacturing precision

If light is emitted only from the upper surface of the LED, then color uniformity is maintained, but light output quantity decreases

Engineering Contradiction:
Improvecolor uniformityVSAvoidlight output
Core Design Contradiction:
Manufacturing precisionVSProductivity

Solution Approach 1:

The patent enables continuous light extraction from all available surfaces (upper and side surfaces) simultaneously. By removing the phosphor layer constraint from side surfaces, the LED can emit light continuously from all surfaces without interruption, maximizing total light output while maintaining color uniformity through the selective phosphor placement on the upper surface.

Inventive Principle:
Principle #20Continuity of useful action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution achieves uniform color emission and increased light output by effectively utilizing light from both the upper and side surfaces, enhancing the light emitting package's performance and application in various lighting applications.

Implementation Method 1

the light controller may be formed to cover a side surface of the first optic layer, and may reflect light emitted from the side surface of the first optic layer

Methodology Applied
Scientific EffectLight reflection: Reflection

Implementation Method 2

utilizing an optical characteristic converter to adjust light wavelengths

Methodology Applied
Scientific EffectWavelength conversion:

Data Source

PatentUS20240363816A1Light emitting package
Publication Date: 2024.10.31 SEOUL SEMICONDUCTOR
  • US20240363816A1 patent drawing
  • US20240363816A1 patent drawing
  • US20240363816A1 patent drawing

AI summary

A light emitting package is provided to include a substrate on which a circuit pattern is formed, a first optic layer, a light controller, and a second optic layer. The first optic layer may be arranged on the substrate to be electrically connected to the circuit pattern and generate and emit light. The light controller may cover a side surface of the first optic layer and may reflect light emitted from the side surface of the first optic layer. In addition, the second optic layer may cover the first optic layer and the light controller and be disposed on the substrate. The second optic layer may include a securing region secured on the substrate and a light emitting region disposed over the securing region. Light emitted from the first optic layer may be emitted to the outside of the second optic layer through the second optic layer.