Light Emitting Plate Wiring Layout With Backup Contact Pairs
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Solution Overview
Problem
Current display technologies face challenges in achieving high brightness and contrast while minimizing power consumption, particularly in mini LED-based systems where backup solutions for defective light emitting diode chips are limited.
Innovation Solution
A light emitting plate and wiring plate design featuring a base substrate with multiple light emitting units and connection line units, each with dual electrical contact pairs, allowing for backup connections to maintain functionality when a light emitting diode chip fails, and dual-side or single-side driving configurations to reduce power consumption.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional single electrical contact pair design is used, then device complexity is reduced, but reliability decreases when light emitting diode chips fail
Solution Approach 1:
The patent implements backup electrical contact pairs in advance before any failure occurs. Each connection line unit contains at least one backup electrical contact pair that remains idle during normal operation but automatically activates when the primary light emitting diode chip fails, ensuring continuous functionality without requiring complex real-time switching mechanisms.
Solution Approach 2:
The patent applies different functions to different parts of the electrical contact structure. Primary electrical contact pairs handle normal operation while backup electrical contact pairs remain dormant until needed. This local differentiation allows the system to maintain simplicity during normal operation while providing reliability when failures occur.
2Use of energy by moving object
If current is concentrated through single negative electrode wire, then manufacturing is simplified, but power consumption increases and performance becomes uneven
Solution Approach 1:
The patent divides the current distribution function by introducing multiple negative electrode wires (first and second negative electrode wires) that extend in different directions. This segmentation distributes the current load across multiple pathways, reducing power consumption and improving current distribution efficiency throughout the light emitting plate.
Solution Approach 2:
The patent transitions from a single-direction current distribution approach to a multi-dimensional distribution system. The first negative electrode wire extends in a first direction while the second negative electrode wire extends in a second direction, creating a two-dimensional current distribution network that improves efficiency and reduces power consumption.
3Illumination intensity
If light emitting diode chips are densely arranged, then brightness is improved, but bonding yield decreases due to higher defect rates
Solution Approach 1:
The patent incorporates backup electrical contact pairs during the manufacturing process before any failures occur. This allows for post-bonding replacement of defective light emitting diode chips by connecting them to backup contact pairs, thereby maintaining high bonding yield even when chips are densely arranged and defect rates increase.
Solution Approach 2:
The patent enables the discarding of defective light emitting diode chips and their replacement with functional ones by utilizing backup electrical contact pairs. This recovery mechanism allows defective chips to be removed and replaced without compromising the overall structure or requiring complex reconfiguration, thus maintaining high bonding yield in dense arrangements.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design enhances the bonding yield of products by providing backup electrical contact pairs and reduces power consumption by distributing current more efficiently across negative electrode wires, ensuring consistent display performance even with defective diode chips.
Implementation Method 1
a light emitting diode chip connected with the connection line unit
Data Source
AI summary
A light emitting plate, a wiring plate and a display device are provided. The light emitting plate includes a base substrate; and light emitting units on the base substrate. Each of the light emitting units includes a light emitting sub-unit, the light emitting sub-unit includes a connection line unit and a light emitting diode chip connected with the connection line unit. The connection line unit includes at least two electrical contact pairs, and each of the at least two electrical contact pairs includes a first electrode contact and a second electrode contact; in each connection line unit, the second electrode contacts are electrically connected with each other, the first electrode contacts are electrically connected with each other, and only one of the at least two electrical contact pairs in each connection line unit is connected with the light emitting diode chip.