Light Receiving Element Shielding Direct Emitter Light
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Solution Overview
Problem
Existing sensor devices with light emitting and receiving elements on the same substrate face challenges in improving sensing performance due to direct light emission onto the receiving element, limiting their effectiveness.
Innovation Solution
The solution involves a light receiving and emitting element configuration where a substrate with a light emitting element and a light receiving element are positioned such that a metal lump or electrode pad is placed between them, blocking direct light emission and enhancing sensing performance by using a semiconductor structure with specific doping concentrations and layers to optimize light path and reduce lattice defects.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If light emitting element and light receiving element are arranged individually on the same substrate with a light-shielding wall, then the device structure is simplified and ease of manufacture is improved, but direct light from the emitting element reaches the receiving element causing sensing performance to deteriorate
Solution Approach 1:
The patent transitions from planar 2D arrangement of light emitting and receiving elements to a 3D stacked configuration where elements are positioned on different layers separated by insulation films. This vertical dimensionality change allows light paths to be controlled through multiple layers without requiring lateral light-shielding walls, thereby improving sensing performance while maintaining manufacturing simplicity.
Solution Approach 2:
The patent introduces insulation films as intermediary layers between the light emitting element and light receiving element. These intermediary insulation layers with specific light transmittance properties control the light paths, allowing desired light to pass while blocking direct unwanted light, thus improving sensing performance without complicating the overall device structure.
2Device complexity
If light is projected directly from light emitting element onto light receiving element, then the device complexity is reduced, but sensing performance cannot be improved due to direct irradiation interference
Solution Approach 1:
The patent segments the device into multiple functional layers including light emitting element, insulation film, light receiving element, and additional insulation layers. This segmentation allows independent optimization of each layer's properties, particularly controlling light paths through the insulation layers, thereby improving sensing performance without significantly increasing overall device complexity.
Solution Approach 2:
The patent resolves the contradiction by moving from a simple planar configuration to a multi-layer vertical structure. The light emitting and receiving elements are positioned on different layers with insulation films controlling light paths in the vertical dimension, enabling improved sensing performance while maintaining relatively simple device architecture.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively suppresses direct irradiation of the light receiving element, resulting in a high sensing performance by ensuring that light is not projected onto the receiving element, thereby improving the detection capabilities of the sensor device.
Implementation Method 1
a light emitting element and a light receiving element which are disposed on an upper face of the substrate, wherein the light emitted from the light emitting element is reflected by the irradiated object and then incident on the light receiving element
Implementation Method 2
the light emitted from the light emitting element is reflected by the irradiated object and then incident on the light receiving element
Data Source
Figure 1(a)~2(b)
Figure 3
Figure 4~5
AI summary
A light receiving and emitting element (1) of the invention includes a substrate (2); a light emitting element (3a) formed on an upper face of the substrate (2); a light receiving element (3b) formed on an upper face side of the substrate (2); a light emitting element-side first electrode pad (31B); and a metal lump (34) joined to the light emitting element-side first electrode pad (31B). The light emitting element-side electrode pad (31B) is disposed the upper face of the substrate (2) through an insulating layer so that the metal lump (34) blocks light emitted from the light emitting element (3a) and propagating toward the light receiving element (3b).