Light-Releasable Adhesive Composition for Semiconductor Lamination
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Solution Overview
Problem
Current adhesive compositions for semiconductor substrates and electronic device layers require multiple layers for adhesion and release, which complicates the process and increases the risk of substrate damage during processing. Additionally, existing methods for releasing these substrates using laser irradiation are not efficient and may cause deformation or cutting of the substrates.
Innovation Solution
A new adhesive composition that forms a single layer with both adhesion and release functions, using a light-absorbing compound, an organic resin, and an organic solvent. This composition allows for easy separation of semiconductor substrates or electronic device layers from their support substrates by light irradiation, ensuring firm adhesion during processing and easy release afterward.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a two-layer structure (adhesive layer + light conversion layer) is used for laser release, then the release function is achieved, but the laminate configuration becomes complex and the number of layers increases
Solution Approach 1:
The patent combines the adhesive layer and light conversion layer into a single integrated adhesive composition. The composition contains both adhesive resins (for bonding function) and light-absorbing compounds (for laser release function), eliminating the need for separate layers while maintaining both adhesion and laser-induced release capabilities
Solution Approach 2:
The adhesive composition serves multiple functions simultaneously: it provides adhesion to bond the semiconductor substrate to the support substrate, contains light-absorbing compounds for laser irradiation response, and enables stress-controlled release. This multi-functional design replaces the traditional two-layer structure with a single versatile layer
2Ease of operation
If mechanical force is applied for substrate removal from support, then the substrate can be detached, but the thinned semiconductor wafer may be cut or deformed
Solution Approach 1:
The patent replaces mechanical force-based release with a photochemical mechanism. The light-absorbing compounds in the adhesive layer absorb laser energy and undergo chemical changes (such as crosslinking or decomposition) that reduce adhesion strength, allowing the substrate to be released without mechanical stress that could cause cutting or deformation
Solution Approach 2:
The adhesive composition's adhesion properties are changed through light irradiation. The light-absorbing compounds undergo parameter changes (chemical structure, crosslinking density, or bonding strength) when exposed to laser, transforming the adhesive from a strong-bonding state to a weak-bonding or release state, enabling stress-free substrate removal
3Length of moving object
If the substrate thickness is reduced to minimize package size, then the package size is reduced, but the substrate strength is reduced and it becomes more susceptible to damage
Solution Approach 1:
The patent provides protective cushioning by using the support substrate as a mechanical strength provider during processing. The thinned semiconductor substrate is bonded to the stronger support substrate, which compensates for the reduced substrate strength and prevents damage during handling and processing operations
Solution Approach 2:
The patent replaces mechanical bonding methods with photochemical bonding and release mechanisms. The laser-induced release mechanism allows for damage-free separation of the thinned substrate from the support, eliminating the risk of mechanical damage that would occur with traditional mechanical release methods
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The adhesive composition enables efficient and stress-free separation of semiconductor substrates or electronic device layers from their support substrates using light irradiation, reducing the risk of damage and simplifying the processing steps while maintaining strong adhesion during processing.
Implementation Method 1
the adhesive layer is used to release the semiconductor substrate or the electronic device layer and the support substrate after the adhesive layer absorbs light emitted from the support substrate side
Implementation Method 2
a light-absorbing compound that contributes to facilitating release of the semiconductor substrate or the electronic device layer and the support substrate by absorbing the light
Data Source
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AI summary
Provided are: a laminate including an adhesive layer which has an adhesion function and a release function in one layer and can be released by light irradiation, wherein when a semiconductor substrate or an electronic device layer is processed, a support substrate and the semiconductor substrate or the electronic device layer can be firmly adhered to each other, and after the substrate is processed, the support substrate and the semiconductor substrate or the electronic device layer can be easily separated from each other by light irradiation; an adhesive composition with which such a releasable adhesive layer is formed; and a method for producing a processed semiconductor substrate or electronic device layer using such a laminate. An adhesive composition for release by light irradiation for forming an adhesive layer of a laminate including a semiconductor substrate or an electronic device layer, a support substrate, and the adhesive layer provided between the semiconductor substrate or the electronic device layer and the support substrate, in which the electronic device layer includes a plurality of semiconductor chip substrates and a sealing resin disposed between the semiconductor chip substrates, and the adhesive layer is used to release the semiconductor substrate or the electronic device layer and the support substrate after the adhesive layer absorbs light emitted from the support substrate side, the adhesive composition comprising: a light-absorbing compound that contributes to facilitating release of the semiconductor substrate or the electronic device layer and the support substrate by absorbing the light; an organic resin; and an organic solvent, wherein the light-absorbing compound is a compound having a structure selected from a group consisting of a benzophenone structure, a diphenylamine structure, a diphenyl sulfoxide structure, a diphenyl sulfone structure, an azobenzene structure, a dibenzofuran structure, a fluorenone structure, a carbazole structure, an anthraquinone structure, a 9,9-diphenyl-9H-fluorene structure, a naphthalene structure, an anthracene structure, a phenanthrene structure, an acridine structure, a pyrene structure, a phenylbenzotriazole structure, and a structure derived from cinnamic acid, or a polyphenol-based compound.