Light-Responsive Adhesive Layer for Easier Electronic Disassembly
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Solution Overview
Problem
In electronic device assembly and maintenance, strong adhesives used for component fixation complicate disassembly, potentially causing damage and reducing yield due to increased disassembly force requirements.
Innovation Solution
An electronic device with an adhesion-reducing adhesive layer whose adhesion is associated with environmental conditions, such as light intensity, allowing for controlled disassembly by adjusting these conditions, and a preset adhesive layer with independent adhesion characteristics.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If glue with higher adhesion is used for adhering components, then the adhering strength between components is improved, but the difficulty for disassembly is increased and the risk of component damage is increased
Solution Approach 1:
The adhesive layer's adhesion is made dynamic by introducing environmental condition sensitivity. The adhesive transitions from a static strong-bond state to a controllable state where adhesion strength varies with environmental conditions (temperature, humidity, light), allowing easy disassembly when conditions change while maintaining strong adhesion during normal operation.
Solution Approach 2:
The adhesive layer's chemical or physical parameters are designed to change in response to environmental conditions. By selecting materials whose adhesion properties are sensitive to temperature, humidity, or light, the system achieves controllable disassembly without requiring mechanical force that could damage components.
2Strength
If glue with higher adhesion is used for adhering components, then the adhering strength between components is improved, but the increase of disassembling force may cause damage to components
Solution Approach 1:
The adhesive layer is designed with parameters that change in response to environmental conditions. This allows the bond strength to be reduced safely under specific conditions (e.g., elevated temperature, specific humidity levels, or light exposure), enabling disassembly without applying excessive force that could damage sensitive components like display screens.
Solution Approach 2:
The adhesive layer acts as an intermediary between components that needs to remain strong during operation but can be safely deactivated. By using environmental conditions as the trigger for adhesion reduction, the system mediates between the need for strong bonding and the need for safe disassembly, protecting components from mechanical damage.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Facilitates easier disassembly of components while minimizing damage by reducing adhesion strength under specific environmental conditions, thereby improving disassembly efficiency and reducing the risk of component damage.
Implementation Method 1
An adhesion of the optical type adhesion-reducing adhesive layer is associated with a light intensity within a predetermined wavelength
Data Source
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AI summary
An electronic device includes: a first member to be adhered; a second member to be adhered; an adhesion-reducing adhesive layer adhered between the first member and the second member. An adhesion of the adhesion-reducing adhesive layer is associated with environmental conditions.