Linkable Semiconductor Processing Facility with Maglev Handling

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

Current semiconductor manufacturing equipment, such as cluster tools and linear systems, face limitations in space efficiency, flexibility, and reliability due to their architectural constraints, leading to issues like particle generation, deflection problems, and complexity in maintaining vacuum environments.

Innovation Solution

The development of a system with linkable or extensible semiconductor processing facilities that include mid-entry points for flexible configuration, air-based delivery systems, and robotic arms like SCARA arms for efficient material handling and processing in a vacuum environment, allowing for sequential or parallel processing of workpieces.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If cluster tools are used to arrange processing modules radially about a central robotic arm, then material handling is achieved, but the system takes up a large amount of space and is limited to a small number of processing modules

Engineering Contradiction:
Improvenumber of processing modulesVSAvoidspace occupied
Core Design Contradiction:
Adaptability or versatilityVSArea of stationary object

Solution Approach 1:

The linear tool is divided into multiple independent processing modules arranged in a linear sequence, each module capable of being independently accessed by robotic arms. This segmentation allows for greater flexibility in the number of modules without requiring a compact radial arrangement, thus increasing adaptability while managing space efficiently through linear extension rather than radial clustering.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The system transitions from a two-dimensional radial arrangement (cluster tool) to a three-dimensional linear configuration with vertical stacking capabilities. Processing modules can be arranged linearly and potentially stacked vertically, utilizing the third dimension to increase the number of modules without proportionally increasing the floor space occupied.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Productivity

If linear tools are used to increase flexibility and speed, then processing capability is improved, but the system generates unacceptable levels of particles due to friction among components

Engineering Contradiction:
Improveprocessing speedVSAvoidparticle generation
Core Design Contradiction:
ProductivityVSObject-generated harmful factors

Solution Approach 1:

The patent replaces traditional mechanical rail and cart systems with magnetic levitation (Maglev) technology. The robotic arms are magnetically levitated above the processing modules, eliminating physical contact and friction between moving components. This substitution of mechanical support with magnetic fields maintains high-speed processing capability while eliminating the particle generation caused by mechanical friction and wear.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The system changes the fundamental operating parameter of material handling from mechanical contact-based movement to contactless magnetic field-based movement. By altering the physical state of interaction from solid-to-solid contact to magnetic field interaction, the system achieves frictionless operation that prevents particle generation while maintaining linear motion capabilities for high-speed processing.

Inventive Principle:
Principle #35Parameter changes

3Speed

If rail-type linear systems are used with carts, then linear motion is achieved, but the system requires a large number of cars on rail to maintain throughput, complicating the system and reducing reliability

Engineering Contradiction:
Improvematerial transport speedVSAvoidsystem complexity
Core Design Contradiction:
SpeedVSDevice complexity

Solution Approach 1:

The patent extracts and eliminates the complex rail infrastructure and multiple cart system from the design. Instead of using a shared rail system requiring multiple carts to maintain throughput, the system uses independent magnetically levitated robotic arms that can independently access and service multiple processing modules. This removes the need for complex rail networks and multiple moving carts, simplifying the system while maintaining high-speed material transport capability.

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The magnetically levitated robotic arms serve multiple functions: they can transport materials between any processing modules, perform processing operations, and independently control material flow. This multi-functionality replaces the specialized rail-cart system where carts were dedicated to specific transport tasks, reducing the number of components needed while maintaining or improving throughput capability.

Inventive Principle:
Principle #6Universality (Multi-functionality)

4Length of moving object

If carts are mounted on rails with wheels, then linear motion is achieved, but particle problems occur due to wheel-rail contact friction

Engineering Contradiction:
Improvelinear travel distanceVSAvoidparticle contamination
Core Design Contradiction:
Length of moving objectVSObject-generated harmful factors

Solution Approach 1:

The patent replaces the wheel-rail mechanical contact system with magnetic levitation technology. Robotic arms are suspended and propelled through magnetic fields without physical contact to the rail structure. This substitution eliminates the friction and wear between wheels and rails that generate particles, allowing for long linear travel distances without particle contamination while maintaining precise positioning capability.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Data Source

PatentUS7959403B2Linear semiconductor processing facilities
Publication Date: 2011.06.14 BROOKS AUTOMATION US LLC
  • US7959403B2 patent drawing
  • US7959403B2 patent drawing
  • US7959403B2 patent drawing

AI summary

Methods and systems are provided for handling materials, including materials used in semiconductor manufacturing systems. The methods and systems include linear semiconductor processing facilities for vacuum-based semiconductor processing and handling, as well as linkable or extensible semiconductor processing facilities that can be flexibly configured to meet a variety of constraints.