Liquid Adhesive Bonding for Homogeneous Substrate Layers
Solution Overview
Problem
Existing methods for bonding substrates, particularly those with different materials or surface properties, face challenges such as uneven adhesive distribution, gas inclusions, and increased surface roughness due to the viscosity of adhesives and coating techniques like centrifugal enameling and spray coating, which can lead to inferior bonding results.
Innovation Solution
A method where a connecting material, preferably a permanent adhesive, is applied as a liquid and distributed automatically between substrates through linear movement, self-regulating to achieve a homogeneous layer thickness and minimize wedge errors, ensuring a defect-free and efficient bonding process without excess adhesive, using gravitational and capillary forces to optimize distribution.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If centrifugal enameling is used to apply adhesive, then adhesive distribution is improved, but surface roughness increases and gas inclusions occur
Solution Approach 1:
The patent changes the physical parameters of the adhesive by using a solvent-based formulation that allows for lower viscosity during application. This enables the adhesive to flow more uniformly during centrifugal enameling, reducing surface roughness and preventing gas inclusions while maintaining good distribution
Solution Approach 2:
The patent employs a multi-stage process with periodic actions: first applying the adhesive with centrifugal enameling, then allowing solvent evaporation, and finally completing the bonding. This periodic approach allows the adhesive to self-level during the evaporation phase, reducing surface defects before final bonding occurs
2Reliability
If adhesive thickness is increased to compensate for surface roughness, then bonding reliability is improved, but product properties are impaired
Solution Approach 1:
The patent applies surface preparation and adhesive formulation optimization before the bonding process to minimize surface roughness and improve wetting. By preliminarily treating the surfaces and using appropriately formulated adhesives, sufficient bonding reliability is achieved with minimal adhesive thickness, preserving product properties
Solution Approach 2:
The patent replaces mechanical pressure bonding with a chemically-driven bonding process. The solvent-based adhesive provides self-leveling and self-bonding capabilities through chemical adhesion, eliminating the need for high pressure and thick adhesive layers to compensate for surface imperfections
3Adaptability or versatility
If permanent adhesive is used to bond different materials, then bonding versatility is improved, but adhesive thickness control becomes difficult
Solution Approach 1:
The patent implements a feedback mechanism through the solvent evaporation process. As the solvent evaporates, the adhesive viscosity increases automatically, providing self-regulation of the adhesive layer thickness. This feedback control enables consistent thickness control across different substrate combinations without requiring complex real-time monitoring
Solution Approach 2:
The adhesive formulation is designed to self-level and self-regulate its thickness during the bonding process. The solvent-based formulation allows the adhesive to flow to the lowest points and self-distribute uniformly, then automatically sets as the solvent evaporates, eliminating the need for external thickness control mechanisms
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach results in a defect-free, efficient, and material-conserving bonding process with a consistent layer thickness, preventing gas inclusions and edge beads, suitable for various substrate shapes and sizes, including transparent substrates, and allows for both temporary and permanent bonding methods.
Implementation Method 1
distributed automatically, in particular exclusively by linear movement of one or two substrates toward one another... by gravitational and capillary forces to optimize distribution
Implementation Method 2
distributed automatically, in particular exclusively by linear movement of one or two substrates toward one another... by gravitational and capillary forces to optimize distribution
Data Source
AI summary
A method for bonding a first substrate with a second substrate by means of a connecting layer that is arranged between the substrates and that is comprised of a connecting material with the following steps: applying the connecting material to the first substrate and/or the second substrate in liquid form, and distributing the connecting material between the substrates by bringing the substrates closer and as a result forming the shape of the connecting layer with a thickness t.