Liquid Alloy TIM Seal Ring for Low-Impedance Package Cooling
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Solution Overview
Problem
Existing thermal interface materials (TIMs) in semiconductor package assemblies, such as gel, film, and solder TIMs, are inadequate for high-power high-performance computing devices due to limited bulk thermal impedance, leading to heat trapping and performance reliability issues.
Innovation Solution
Incorporation of a liquid alloy TIM with a high thermal conductivity, surrounded by a seal ring to prevent pump-out, and a package lid design that enhances heat dissipation by controlling bond-line-thickness and contact resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional TIM materials (gel, film, solder) are used, then the package assembly can be manufactured with existing processes, but the bulk thermal impedance is too high leading to heat trapping and reliability issues
Solution Approach 1:
The patent changes the physical state of the TIM from solid (gel, film, solder) to liquid alloy, which fundamentally alters the thermal conductivity parameter. The liquid alloy TIM achieves bulk thermal impedance of less than 3.4° C.-mm2/W, significantly improving heat dissipation compared to conventional materials while maintaining manufacturing feasibility through controlled dispensing and sealing processes
Solution Approach 2:
The patent creates a composite structure combining liquid alloy TIM with a seal ring configuration. This composite approach allows the liquid alloy to provide superior thermal performance while the seal ring prevents pump-out and maintains structural integrity, resolving the contradiction between improved thermal impedance and device reliability
2Temperature
If liquid alloy TIM is used to reduce bulk thermal impedance, then heat dissipation improves, but the liquid TIM may pump out without containment
Solution Approach 1:
The seal ring acts as an intermediary element between the liquid alloy TIM and the package structures. It provides containment and prevents pump-out of the liquid TIM while maintaining thermal contact, thus enabling improved heat dissipation without compromising TIM stability or containment
Solution Approach 2:
The seal ring functions as a flexible containment structure that adapts to the liquid alloy TIM. This flexible sealing mechanism effectively contains the liquid TIM, preventing pump-out while allowing the liquid alloy to maintain its liquid state for optimal thermal conductivity and heat dissipation performance
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The liquid alloy TIM with a seal ring configuration achieves improved thermal performance, reducing bulk thermal impedance to less than 3.4° C.-mm2/W, ensuring effective heat dissipation and enhancing the reliability of high-power HPC devices.
Implementation Method 1
the liquid alloy TIM with a high thermal conductivity, surrounded by a seal ring to prevent pump-out, and a package lid design that enhances heat dissipation
Implementation Method 2
Incorporation of a liquid alloy TIM with a high thermal conductivity
Data Source
AI summary
A package assembly includes an interposer module on a package substrate, a liquid alloy thermal interface material (TIM) on the interposer module, a seal ring surrounding the liquid alloy TIM, and a package lid on the liquid alloy TIM and seal ring, wherein the seal ring, interposer module and package lid seal the liquid alloy TIM.