Liquid-Cooled Plate with Single- and Two-Phase Heat Dissipation

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Solution Overview

Problem

Existing air cooling and single-phase liquid cooling methods struggle to effectively manage high heat flow densities in electronic devices, leading to non-uniform temperature distribution, increased thermal resistance, and potential overheating due to subcooling issues and limited convection heat exchange areas.

Innovation Solution

A liquid-cooled plate with integrated single-phase and two-phase channels, featuring fins and optionally metal foam, enhances heat exchange by converting liquid-state coolant to gas-liquid two-phase coolant, reducing thermal resistance and improving temperature uniformity through machined surfaces and structured channels.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Power

If two-phase fluid circuit is used for heat dissipation, then heat transfer capacity is improved, but subcooling problem reduces temperature uniformity

Engineering Contradiction:
Improveheat transfer capacityVSAvoidtemperature uniformity
Core Design Contradiction:
PowerVSTemperature

Solution Approach 1:

The cold plate is divided into multiple independent channels, each functioning as a separate heat dissipation unit. This segmentation allows each channel to independently manage its thermal characteristics, preventing the subcooling effect in one channel from adversely affecting temperature uniformity across the entire system while maintaining high heat transfer capacity through two-phase flow in each channel.

Inventive Principle:
Principle #1Segmentation

2Power

If two-phase system is used, then heat exchange efficiency is improved, but high pressure limits flow channel structure optimization

Engineering Contradiction:
Improveheat exchange efficiencyVSAvoidflow channel structure optimization
Core Design Contradiction:
PowerVSDevice complexity

Solution Approach 1:

Different regions of the cold plate are designed with locally optimized channel structures tailored to specific heat dissipation requirements. High heat flux areas receive enhanced cooling configurations while lower heat flux areas use simpler channel designs, allowing structure optimization without being constrained by the high pressure of the two-phase system.

Inventive Principle:
Principle #3Local quality

3Device complexity

If single-phase liquid cooling is used, then system simplicity is maintained, but heat dissipation capability is insufficient for high heat flow density

Engineering Contradiction:
Improvesystem simplicityVSAvoidheat dissipation capability
Core Design Contradiction:
Device complexityVSPower

Solution Approach 1:

The system transitions from single-phase liquid cooling to two-phase flow cooling by changing the thermodynamic state parameter of the coolant. This parameter change enables dramatically improved heat dissipation capability through phase change heat transfer, while the modular channel design maintains relative system simplicity by using standardized components and configurations.

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution achieves high heat transfer capacity, enhanced temperature uniformity, and reduced thermal resistance, effectively managing high heat flow densities and preventing overheating in electronic devices.

Implementation Method 1

The first fins are configured to perform a heat exchange with a liquid-state coolant flowing through the single-phase channel to convert the liquid-state coolant after the heat exchange into a gas-liquid two-phase coolant

Methodology Applied
Scientific EffectPhase change: Phase Change

Implementation Method 2

the second fins are configured to perform a heat exchange with a gas-liquid two-phase coolant flowing through the two-phase channel to output a coolant after the heat exchange

Methodology Applied
Scientific EffectHeat exchange: Heat Exchanger

Implementation Method 3

The pump is configured to enable a coolant passing through the pump to flow into the liquid-cooled plate to perform heat absorption

Methodology Applied
Scientific EffectFluid flow: Pump

Implementation Method 4

the condenser is configured to enable the coolant after the heat absorption to flow back into the liquid-cooled plate after heat release

Methodology Applied
Scientific EffectHeat release: Heat Exchanger

Data Source

PatentUS12453052B2Liquid-cooled plate and heat dissipation device
Publication Date: 2025.10.21 ZTE CORP
  • US12453052B2 patent drawing
  • US12453052B2 patent drawing
  • US12453052B2 patent drawing

AI summary

A liquid-cooled plate and a heat dissipation device are disclosed. The liquid-cooled plate includes a single-phase channel and a two-phase channel. First fins are spaced apart in the single-phase channel and second fins are spaced apart in the two-phase channel. The first fins are configured to perform a heat exchange with a liquid-state coolant flowing through the single-phase channel to convert the liquid-state coolant after the heat exchange into a gas-liquid two-phase coolant, and the second fins are configured to perform a heat exchange with a gas-liquid two-phase coolant flowing through the two-phase channel to output a coolant after the heat exchange.