Liquid Cooled Test Socket for Semiconductor IC Chips
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Solution Overview
Problem
Existing IC chip testing systems fail to effectively cool both the IC chip and the test socket, leading to degradation of the test socket and compromised testing integrity due to heat buildup.
Innovation Solution
A liquid-cooled test socket system where test socket contacts are at least partially submerged in a two-phase fluid coolant, which is circulated through the system to absorb and dissipate heat efficiently.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If IC chips are tested with high current throughput and power consumption, then testing capability is improved, but heat generation increases causing test socket degradation
Solution Approach 1:
The patent introduces a liquid coolant as an intermediary substance between the test socket contacts and the surrounding environment. The coolant circulates through channels in the test socket, absorbing heat generated during high-power IC chip testing and transferring it away from the test socket, thereby enabling sustained high-current testing without degradation
Solution Approach 2:
The patent employs a liquid cooling system where coolant flows through hydraulic channels integrated into the test socket structure. This hydraulic approach enables efficient heat removal from the test socket contacts during high-power testing operations
2Productivity
If test socket operates for extended periods, then productivity is improved, but heat buildup degrades test socket integrity
Solution Approach 1:
The patent implements continuous coolant circulation through the test socket during extended testing operations. The cooling system operates continuously to maintain thermal management throughout prolonged test periods, ensuring test socket integrity is preserved throughout extended productivity cycles
Solution Approach 2:
The liquid coolant serves as a continuous intermediary that mediates heat transfer from the test socket during extended operations, preventing heat buildup that would compromise test socket reliability over time
3Temperature
If cooling system is added to test socket, then temperature control is improved, but device complexity increases
Solution Approach 1:
The patent merges the cooling function with the test socket structure by integrating coolant channels directly into the test socket body. This consolidation combines the test socket and cooling system into a single integrated component, achieving temperature control without proportionally increasing overall system complexity
Solution Approach 2:
The test socket is designed with multi-functionality, serving both as an electrical test interface and as a thermal management device. The integrated coolant channels enable the test socket to perform both testing and cooling functions simultaneously
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system effectively maintains the integrity of IC chip testing by reducing heat-related degradation of the test socket and ensuring precise signal transmission, thereby extending the lifecycle of the test socket and improving testing accuracy.
Implementation Method 1
The chamber is configured to receive a two phase fluid coolant via the inlet to at least partially submerge the plurality of contacts in the two phase fluid coolant
Implementation Method 2
The fluid coolant system includes a reservoir configured to hold a two phase fluid coolant
Implementation Method 3
The fluid coolant system includes an inlet pathway coupled between the reservoir and the test socket, the inlet pathway configured to carry the two phase fluid coolant to the test socket
Implementation Method 4
The housing at least partially defines a chamber in fluid communication with an inlet, a liquid outlet, and a vapor outlet
Data Source
AI summary
A test socket for an IC chip includes a retainer positioned adjacent a load board, the retainer defining a plurality of apertures corresponding to contact pads on the load board; a plurality of contacts disposed in the plurality of apertures, the plurality of contacts configured to electrically couple the IC chip to the contact pads; a housing defining a chamber in fluid communication with an inlet, a liquid outlet, and a vapor outlet. The housing includes a body structure defining a plurality of cavities corresponding to the plurality of apertures and configured to receive the plurality of contacts therein, and a guide structure configured to receive the IC chip and position the IC chip in the chamber when engaged with the plurality of contacts. The chamber receives a two phase fluid coolant via the inlet to at least partially submerges the plurality of contacts in the two phase fluid coolant.