Liquid Cooling Plate Buffer Structure for Lower Flow Resistance
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Solution Overview
Problem
Existing liquid cooling devices face issues with flow resistance and increased system complexity due to direct connection of external liquid pipelines to cooling plates, leading to larger plate thickness and reduced cooling efficiency.
Innovation Solution
A cooling device with a buffer portion between the inlet and outlet pipes and the flow passage, featuring inlet and outlet buffer zones, right-angle passages, and inclined buffer sections to reduce flow resistance and enable a thinner cooling plate design.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If external liquid pipelines are directly connected to cooling plate, then cooling function is achieved, but flow resistance increases and cooling plate thickness increases
Solution Approach 1:
The patent introduces a buffer portion as an intermediary component between the liquid pipeline and the cooling plate. This buffer portion includes a buffer cavity with inlet and outlet buffer zones that smoothly transition liquid flow, eliminating direct collision with the cooling plate inner wall and reducing flow resistance while maintaining effective cooling.
2Ease of manufacture
If cooling plate diameter matches pipeline diameter, then connection is simplified, but cooling plate thickness increases
Solution Approach 1:
The patent resolves the dimensional conflict by transitioning the connection structure from a planar arrangement to a three-dimensional buffer cavity structure. The buffer portion extends in the thickness direction with inclined buffer zones, allowing the cooling plate to maintain a smaller diameter matching the pipeline while reducing overall thickness through the angled flow path design.
3Strength
If cooling plate thickness increases, then structural strength is improved, but cooling rate decreases
Solution Approach 1:
The patent applies local quality by creating regions of different thickness within the cooling plate structure. The buffer portion has increased thickness to provide structural strength and accommodate the buffer cavity, while the main cooling plate maintains reduced thickness to optimize cooling rate. This localized thickness variation allows simultaneous achievement of structural integrity and high cooling efficiency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The buffer portion reduces flow resistance and power loss, allowing for a thinner cooling plate design while maintaining efficient temperature control and reducing manufacturing costs.
Implementation Method 1
the buffer portion can reduce the flow resistance of the liquid flowing into the flow passage
Implementation Method 2
liquid cooling has gradually been favored by the market and has become one of the mainstream developments in the field of electronic heat dissipation
Data Source
AI summary
A cooling device includes a cooling plate and a buffer portion, a flow passage is formed in the cooling plate, and the buffer portion is arranged on the cooling plate. An inlet buffer zone and an outlet buffer portion are defined in the buffer portion, liquid flows into the flow passage through the inlet buffer zone and flows out of the flow passage through the outlet buffer portion. The liquid flows into the flow passage through the buffer portion, and the buffer portion can reduce the flow resistance of the liquid flowing into the flow passage. The liquid in the flow passage also flows out through the buffer portion, and the buffer portion can also reduce the flow resistance of the liquid flowing out of the flow passage.